Semiconductor device, display device, and electronic device

ABSTRACT

To prevent an influence of normally-on characteristics of the transistor which a clock signal is input to a terminal of, a wiring to which a first low power supply potential is applied and a wiring to which a second low power supply potential lower than the first low power supply potential is applied are electrically connected to a gate electrode of the transistor. A semiconductor device including the transistor can operate stably.

This application is a divisional of copending U.S. application Ser. No.14/090,209, filed on Nov. 26, 2013 which is incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

One embodiment of the present invention relates to a semiconductordevice, a display device, a light-emitting device, a driving methodthereof, or a driving method thereof. In particular, one embodiment ofthe present invention relates to a pulse signal output circuit and ashift register. One embodiment of the present invention relates to adisplay device and an electronic device which include the pulse signaloutput circuit and the shift register.

2. Description of the Related Art

Transistors which are used for most flat panel displays typified byliquid crystal display devices and light-emitting display devicesinclude silicon semiconductors such as amorphous silicon, single crystalsilicon, and polycrystalline silicon in many cases.

Although transistors including amorphous silicon have low field effectmobility, they can be formed over larger glass substrates. In contrast,although transistors including polycrystalline silicon have high fieldeffect mobility, they need a crystallization process such as laserannealing and are not always suitable for larger glass substrates.

In recent years, attention has been drawn to a technique in which,instead of a silicon semiconductor, a metal oxide exhibitingsemiconductor characteristics is used for transistors. Note that in thisspecification, a metal oxide exhibiting semiconductor characteristics isreferred to as an oxide semiconductor. For example, Patent Documents 1and 2 disclose a technique by which a transistor is formed using zincoxide or an In—Ga—Zn—O-based oxide semiconductor as a semiconductormaterial and is used as a switching element of an image display device.

Further, such transistors including oxide semiconductors can be used asswitching elements included in pixel portions and driver circuits ofdisplay devices such as liquid crystal displays, electroluminescentdisplays, and electronic paper. For example, Patent Document 3 disclosesa technique in which a driver circuit is formed using a shift registerand the like including a pulse signal output circuit, and a transistorincluding the above oxide semiconductor is used as a transistor in thepulse signal output circuit.

REFERENCE

[Patent Document 1] Japanese Published Patent Application No.2007-123861

[Patent Document 2] Japanese Published Patent Application No. 2007-96055

[Patent Document 3] Japanese Published Patent Application No.2011-205627

SUMMARY OF THE INVENTION

In the case where a shift register including a pulse signal outputcircuit and included in the driver circuit includes transistors havingthe same polarity, the shift register might have a problem of unstableoperation, for example. For example, conventional pulse signal outputcircuits have a problem of variation in electrical characteristics of atransistor when the transistor deteriorates owing to high amplitude of aclock signal.

In addition, long-time application of stress to a transistor causes ashift in the threshold voltage (also referred to as Vth) of thetransistor in some cases. For example, by continuous application ofpositive voltage to a drain electrode of an n-channel transistor, thethreshold voltage of the n-channel transistor shifts in negativedirection with time. In such a case, a problem of turning on thetransistor even when a gate voltage is 0 V, that is, becomingnormally-on is caused.

In view of the above problems, an object of one embodiment of thepresent invention is to prevent deterioration in a transistor. An objectof one embodiment of the present invention is to normally drive acircuit including a transistor. An object of one embodiment of thepresent invention is to reduce leakage current of a transistor toprevent an influence of normally-on characteristics of a transistor. Anobject of one embodiment of the present invention is to provide highlyreliable display device. An object of one embodiment of the presentinvention is to provide a pulse signal output circuit showing stableelectrical characteristics.

Note that the descriptions of these problems do not disturb theexistence of other problems. Note that in one embodiment of the presentinvention, there is no need to achieve all the objects. Other objectswill be apparent from and can be derived from the description of thespecification, the drawings, the claims, and the like.

A second low power supply potential is applied to a gate electrode of atransistor electrically connected to a terminal to which the clocksignal is input. The second low power supply potential is lower than afirst low power supply potential which is supplied to the clock signal.By application of the second low power supply potential to the gateelectrode of the transistor, a semiconductor device which stablyoperates is obtained. The structure is more specifically describedbelow.

One embodiment of the present invention is a semiconductor device whichincludes a first input terminal to which a start pulse signal is input;a second input terminal to which a clock signal is input, a third inputterminal to which a reset signal is input, an output terminal from whicha pulse signal is output, a first transistor, a second transistor, and athird transistor. A first terminal of the first transistor iselectrically connected to the first input terminal. A second terminal ofthe first transistor is electrically connected to a gate electrode ofthe second transistor. A gate electrode of the first transistor iselectrically connected to the first terminal of the first transistor. Afirst terminal of the second transistor is electrically connected to thesecond input terminal. A second terminal of the second transistor iselectrically connected to a first terminal of the third transistor andthe output terminal. A second terminal of the third transistor iselectrically connected to a wiring to which a first low power supplypotential is applied. A gate electrode of the third transistor iselectrically connected to the third input terminal. The first low powersupply potential and a high power supply potential are applied to thegate electrode of the first transistor with the start pulse signal, anda second low power supply potential which is lower than the first lowpower supply potential is applied to the gate electrode of the secondtransistor when the first low power supply potential is applied to thegate electrode of the first transistor.

According to one embodiment of the present invention, deterioration of atransistor can be prevented. According to one embodiment of the presentinvention, a circuit including a transistor can normally operate.According to one embodiment of the present invention, an influence ofnormally-on characteristics of a transistor is prevented and leakagecurrent of the transistor can be reduced. According to one embodiment ofthe present invention, a pulse signal output circuit showing stableelectrical characteristics can be provided.

A highly reliable display device can be provided by using a pulse signaloutput circuit and a shift register of one embodiment of the presentinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1C illustrate pulse signal output circuits of one embodimentof the present invention.

FIGS. 2A to 2F illustrate pulse signal output circuits of one embodimentof the present invention.

FIGS. 3A and 3B illustrate a pulse signal output circuit of oneembodiment of the present invention and a shift register.

FIGS. 4A and 4B illustrate pulse signal output circuits of oneembodiment of the present invention.

FIG. 5 is a timing chart of a pulse signal output circuit of oneembodiment of the present invention.

FIGS. 6A to 6C illustrate a display device including a pulse signaloutput circuit of one embodiment of the present invention.

FIG. 7 is a timing chart of a display device including a pulse signaloutput circuit of one embodiment of the present invention.

FIG. 8 illustrates a display device including a pulse signal outputcircuit of one embodiment of the present invention.

FIGS. 9A and 9B each illustrate a display device including a pulsesignal output circuit of one embodiment of the present invention.

FIGS. 10A and 10B illustrate a cross-sectional structure of an oxidestack of one embodiment of the present invention.

FIGS. 11A to 11D each illustrate a band structure of an oxide stack ofone embodiment of the present invention.

FIGS. 12A to 12C each illustrate a cross-sectional structure of an oxidestack of one embodiment of the present invention.

FIG. 13 illustrates a change in electrical characteristics of atransistor including an oxide semiconductor layer.

FIG. 14 is an energy band diagram in a transistor including an oxidesemiconductor layer.

FIGS. 15A to 15C are deterioration modes of a transistor including anoxide semiconductor layer.

FIGS. 16A and 16B are an energy band diagram of a transistor includingan oxide semiconductor layer, and a diagram showing the correspondingdeterioration model.

FIGS. 17A and 17B are an energy band diagram of a transistor includingan oxide semiconductor layer, and a diagram showing the correspondingdeterioration model.

FIGS. 18A and 18B are an energy band diagram of a transistor includingan oxide semiconductor layer, and a diagram showing the correspondingdeterioration model.

FIGS. 19A and 19B each illustrate a cross-sectional structure of atransistor including an oxide semiconductor layer.

FIGS. 20A to 20C each illustrate an electronic device including adisplay device of one embodiment of the present invention.

FIGS. 21A to 21C illustrate an electronic device including a displaydevice of one embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments will be described in detail with reference to the drawings.Note that the invention is not limited to the following description, andit will be easily understood by those skilled in the art that variouschanges and modifications can be made without departing from the spiritand scope of the invention. Therefore, the invention should not beconstrued as being limited to the description in the followingembodiments. Note that in the structures of the invention describedbelow, the same portions or portions having similar functions aredenoted by the same reference numerals in different drawings, anddescription of such portions is not repeated.

Note that in each drawing described in this specification, a size ofeach component or a thickness of each layer or an area is exaggerated insome cases for clarification. Therefore, embodiments of the presentinvention are not limited to such scales.

In this specification and the like, ordinal numbers such as “first”,“second”, and “third” are used in order to avoid confusion amongcomponents, and the terms do not limit the components numerically.

Embodiment 1

In this embodiment, a pulse signal output circuit of one embodiment ofthe present invention and a shift register including the pulse signaloutput circuit will be described with reference to FIGS. 1A to 1C, FIGS.2A to 2F, FIGS. 3A and 3B, FIGS. 4A and 4B, and FIG. 5.

FIGS. 1A to 1C illustrate examples of a pulse signal output circuit ofthis embodiment. As in FIG. 1A, a pulse signal output circuit has afunction of generating a pulse signal (an output signal OUT) inaccordance with a set signal S, a reset signal R, and a clock signalCLK, which are input to the pulse signal output circuit. Note thatplural kinds of clock signals may be input to the pulse signal outputcircuit.

The pulse signal output circuit illustrated in FIG. 1A can have astructure of a pulse signal output circuit illustrated in FIG. 1B, forexample. The pulse signal output circuit illustrated in FIG. 1B includesa first input terminal 21 to which the set signal S is input, a secondinput terminal 22 to which the clock signal CLK is input, a third inputterminal 23 to which the reset signal R is input, a first outputterminal 24 from which a pulse signal is output, a transistor 102, atransistor 104, a transistor 106, and a switching element 107.

For example, the transistors 102, 104, and 106 can be transistors havingthe same conductivity type. The switching of the transistors iscontrolled in accordance with one or more of the set signal S, the resetsignal R, and the clock signal CLK. As the set signal S, for example, astart pulse signal SP can be used. The switching of the switchingelement 107 is controlled in accordance with a second low power supplypotential VEE. The switching element 107 is an element performingswitching in accordance with an electric signal, such as a relay, atransistor, or a diode. Thus, the switching element 107 can have thesame conductivity type as that of the transistors 102, 104, and 106, forexample.

In FIG. 1B, a first terminal of the transistor 102 is connected to agate electrode of the transistor 102. Note that the structure is notlimited thereto, and as in FIG. 1C, the gate electrode of the transistor102 may be electrically connected to another wiring or the like, forexample.

The pulse signal output circuits illustrated in FIGS. 1B and 1C may havethe structures in FIGS. 2A to 2F, for example. Note that in the pulsesignal output circuits illustrated in FIGS. 2A to 2F, a transistor isused as the switching element 107, for example.

The structures illustrated in FIGS. 2A to 2D can be formed by changingthe connection portions of the transistor 102 and the switching element107 in the pulse signal output circuits illustrated in FIGS. 1B and 1C.

In the structures illustrated in FIGS. 2E and 2F, a first terminal ofthe switching element 107 is electrically connected to a gate electrodeof the switching element 107. That is, the switching element 107 is adiode-connected transistor. The second low power supply potential VEE issupplied as a pulse, for example, whereby the switching element 107 isturned on or off. A potential which is supplied as the pulse is notlimited to the second low power supply potential VEE. For example, afirst low power supply potential VSS, a first high power supplypotential VDD, or a second high power supply potential VCC may be used.In particular, to turn off the switching element 107, a high potentialsuch as the first high power supply potential VDD or the second highpower supply potential VCC is preferably applied to the switchingelement 107. In particular, to turn on the switching element 107, a lowpotential such as the first low power supply potential VSS or the secondlow power supply potential VEE is preferably applied to the switchingelement 107.

Note that the clock signal CLK is a signal which alternates a high level(hereinafter, an H level) and a low level (hereinafter, an L level) atregular intervals.

When the clock signal CLK is at an H level, the first high power supplypotential VDD is applied to the second input terminal 22 to which theclock signal CLK is input. When the clock signal CLK is at an L level,the first low power supply potential VSS is applied to the second inputterminal 22 to which the clock signal CLK is input.

Accordingly, H-level and L-level potentials are alternately supplied tothe transistor 104 which is electrically connected to the second inputterminal 22 at regular intervals. Since the clock signal CLK is suppliedto the transistor 104 for a long time, a load on the transistor 104 islarger than that on the other transistors. For example, when a firstterminal of the transistor 104, which is electrically connected to thesecond input terminal 22, is a drain electrode, an H level of the clocksignal, that is, the first high power supply potential VDD isintermittently applied to the drain electrode. This might result innegative shift of the threshold voltage of the transistor 104.

On the other hand, the pulse signal output circuit illustrated in FIG.1B uses the second low power supply potential VEE which is lower thanthe first low power supply potential VSS. Thus, a stable pulse signalcan be output even when the threshold voltage of the transistor 104shifts in the negative direction. For example, the second low powersupply potential VEE can be lower than an L-level potential.

In the pulse signal output circuit illustrated in FIG. 1B, when thetransistor 102 is in an off state, the second low power supply potentialVEE, which is lower than the first low power supply potential VSS, isapplied to a gate electrode of the transistor 104 through the switchingelement 107, and a second terminal of the third transistor 106 isconnected to a signal line to which the first low power supply potentialVSS is applied.

The pulse signal output circuit illustrated in FIG. 1B includes thefirst input terminal 21 to which a start pulse signal is input, thesecond input terminal 22 to which a clock signal is input, the thirdinput terminal 23 to which a reset signal is input, the first outputterminal 24 from which a pulse signal is output, the transistor 102, thetransistor 104, and the transistor 106. The first terminal of thetransistor 102 is electrically connected to the first input terminal 21.A second terminal of the transistor 102 is electrically connected to thegate electrode of the transistor 104. The gate electrode of thetransistor 102 is electrically connected to the first terminal of thetransistor 102. The first terminal of the transistor 104 is electricallyconnected to the second input terminal 22. A second terminal of thetransistor 104 is electrically connected to a first terminal of thetransistor 106 and the first output terminal 24. The second terminal ofthe transistor 106 is electrically connected to a wiring to which thefirst low power supply potential VSS is applied. A gate electrode of thetransistor 106 is electrically connected to the third input terminal 23.The first low power supply potential VSS and the first high power supplypotential VDD are applied to the gate electrode of the transistor 102 bya start pulse signal. While the first low power supply potential VSS isapplied to the gate electrode of the transistor 102, the second lowpower supply potential VEE, which is lower than the first low powersupply potential VSS, is applied to the gate electrode of the transistor104.

The pulse signal output circuits illustrated in FIGS. 1A to 1C and FIGS.2A to 2F may have a structure of a pulse signal output circuitillustrated in FIG. 3A, for example.

The pulse signal output circuit illustrated in FIG. 3A includes thefirst input terminal 21, the second input terminal 22, the third inputterminal 23, the first output terminal 24, a second output terminal 25,and a fourth input terminal 26.

For example, in the pulse signal output circuit illustrated in FIG. 3A,the start pulse signal SP is input to the first input terminal 21, afirst clock signal CLK1 is input to the second input terminal 22, areset signal is input to the third input terminal 23, a signal which isinput to another wiring or a pulse signal output circuit in the nextstage is output from the first output terminal 24, a signal which isinput to the pulse signal output circuit in the next stage is outputfrom the second output terminal 25, and an inverted start pulse signal(SPB) is input to the fourth input terminal 26.

That is, the pulse signal output circuit illustrated in FIG. 3A has astructure where the second output terminal 25 and the fourth inputterminal 26 are added to the pulse signal output circuit illustrated inFIG. 1A.

FIG. 3B illustrates an example of a shift register including a pluralityof pulse signal output circuits illustrated in FIG. 3A.

The shift register illustrated in FIG. 3B includes a first pulse signaloutput circuit 10_1, a second pulse signal output circuit 10_2, a thirdpulse signal output circuit 10_3, a fourth pulse signal output circuit10_4, and a fifth pulse signal output circuit 10_5.

The first clock signal CLK1 is input to the first pulse signal outputcircuit 10_1 from a wiring 11. A second clock signal CLK2 is input tothe second pulse signal output circuit 10_2 from a wiring 12. A thirdclock signal CLK3 is input to the third pulse signal output circuit 10_3from a wiring 13. A fourth clock signal CLK4 is input to the fourthpulse signal output circuit 10_4 from a wiring 14. The first clocksignal CLK1 is input to the fifth pulse signal output circuit 10_5 fromthe wiring 11.

A start pulse signal (SP) is input to the first pulse signal outputcircuit 10_1 from a wiring 15. An output signal (OUT_1) is input to thesecond pulse signal output circuit 10_2 from the first pulse signaloutput circuit 10_1. An output signal (OUT_2) is input to the thirdpulse signal output circuit 10_3 from the second pulse signal outputcircuit 10_2. An output signal (OUT_3) is input to the fourth pulsesignal output circuit 10_4 from the third pulse signal output circuit10_3. An output signal (OUT_4) is input to the fifth pulse signal outputcircuit 10_5 from the fourth pulse signal output circuit 10_4.

An inverted start pulse signal (SPB) is input to the first pulse signaloutput circuit 10_1 from a wiring 16. An inverted start pulse signal(SPB) is input to the second pulse signal output circuit 10_2 from thefirst pulse signal output circuit 10_1. An inverted start pulse signal(SPB) is input to the third pulse signal output circuit 10_3 from thesecond pulse signal output circuit 10_2. An inverted start pulse signal(SPB) is input to the fourth pulse signal output circuit 10_4 from thethird pulse signal output circuit 10_3. An inverted start pulse signal(SPB) is input to the fifth pulse signal output circuit 10_5 from thefourth pulse signal output circuit 10_4.

The output signal (OUT_1) is output from the first pulse signal outputcircuit 10_1. A wiring supplying the output signal (OUT_1) is connectedto another wiring or the pulse signal output circuit in the next stage.The output signal (OUT_2) is output from the second pulse signal outputcircuit 10_2. A wiring supplying the output signal (OUT_2) is connectedto another wiring or the pulse signal output circuit in the next stage.The output signal (OUT_3) is output from the third pulse signal outputcircuit 103. A wiring supplying the output signal (OUT_3) is connectedto another wiring or the pulse signal output circuit in the next stage.The output signal (OUT_4) is output from the fourth pulse signal outputcircuit 10_4. A wiring supplying the output signal (OUT_4) is connectedto another wiring or the pulse signal output circuit in the next stage.The output signal (OUT_5) is output from the fifth pulse signal outputcircuit 10_5. A wiring supplying the output signal (OUT_5) is connectedto another wiring.

To the first pulse signal output circuit 10_1, a signal output from thesecond pulse signal output circuit 10_2 (next stage) is input. To thesecond pulse signal output circuit 10_2, a signal output from the thirdpulse signal output circuit 10_3 (next stage) is input. To the thirdpulse signal output circuit 10_3, signal output from the fourth pulsesignal output circuit 10_4 (next stage) is input. To the fourth pulsesignal output circuit 10_4, a signal output from the fifth pulse signaloutput circuit 10_5 (next stage) is input. To the fifth pulse signaloutput circuit 10_5, a reset signal (R) from a wiring 17 is input.

As described above, the pulse signal output circuit of one embodiment ofthe present invention can be used for a shift register having aplurality of stages.

An example of a specific circuit structure of the pulse signal outputcircuit illustrated in FIG. 3A will be described with reference to FIGS.4A and 4B.

A pulse signal output circuit illustrated in FIG. 4A includes thetransistor 102, the transistor 104, the transistor 106, a transistor108, a transistor 110, a transistor 112, a transistor 114, a transistor116, and a capacitor 118.

The pulse signal output circuit illustrated in FIG. 4A is electricallyconnected to a wiring 120 to which the second high power supplypotential VCC is applied, a wiring 122 to which the second low powersupply potential VEE is applied, a wiring 124 to which the first lowpower supply potential VSS is applied, and a wiring 126 to which thesecond low power supply potential VEE is applied, in addition to thefirst input terminal 21, the second input terminal 22, the third inputterminal 23, the first output terminal 24, the second output terminal25, and the fourth input terminal 26 which are illustrated in FIG. 2A.

To the second input terminal 22 to which the clock signal CLK is input,the first high power supply potential VDD is applied when the clocksignal CLK is at an H level, and the first low power supply potentialVSS is applied when the clock signal CLK is at an L level. Here, themagnitude relationship between the power supply potentials satisfies“the first high power supply potential VDD>the second high power supplypotential VCC>the first low power supply potential VSS>the second lowpower supply potential VEE”.

In the pulse signal output circuit illustrated in FIG. 4A, an outputsignal (OUT[n−1]) is input to the first input terminal 21 from a pulsesignal output circuit in the preceding stage, a clock signal (CLK) isinput to the second input terminal 22, an inverted output signal(OUTB[n−1]) is input to the third input terminal 23 from a pulse signaloutput circuit in the preceding stage, an output signal (OUT[n]) isoutput from the first output terminal 24, an inverted output signal(OUTB [n]) is output from the second output terminal 25, and an invertedoutput signal (OUTB[n+1]) is input to the fourth input terminal 26 fromthe pulse signal output circuit in the next stage. Note that n is anatural number of 2 or more.

The first terminal of the transistor 102 is electrically connected tothe first input terminal 21. The second terminal of the transistor 102is electrically connected to the gate electrode of the transistor 104.The gate electrode of the transistor 102 is electrically connected tothe first terminal of the transistor 102. The first terminal of thetransistor 104 is electrically connected to the second input terminal22. The second terminal of the transistor 104 is electrically connectedto the first terminal of the transistor 106. The second terminal of thetransistor 106 is connected to a first terminal of the transistor 108.The gate electrode of the transistor 106 is electrically connected tothe third input terminal 23. A second terminal of the transistor 108 iselectrically connected to the wiring 124. A gate electrode of thetransistor 108 is electrically connected to the fourth input terminal26.

A first terminal of the transistor 110 is electrically connected to thesecond terminal of the transistor 102, the gate electrode of thetransistor 104, and one electrode of the capacitor 118. A secondterminal of the transistor 110 is connected to a first terminal of thetransistor 112. A gate electrode of the transistor 110 is electricallyconnected to the third input terminal 23 and the gate electrode of thetransistor 106. A second terminal of the transistor 112 is electricallyconnected to the wiring 122. A gate electrode of the transistor 112 iselectrically connected to the fourth input terminal 26 and the gateelectrode of the transistor 108.

A first terminal of the transistor 114 is electrically connected to thewiring 120. A second terminal of the transistor 114 is electricallyconnected to the first terminal of the transistor 116. A gate electrodeof the transistor 114 is electrically connected to the first terminal ofthe transistor 114. A second terminal of the transistor 116 iselectrically connected to the wiring 126. A gate electrode of thetransistor 116 is electrically connected to the other electrode of thecapacitor 118 and the first output terminal 24. The second terminal ofthe transistor 114 and the first terminal of the transistor 116 areelectrically connected to the second output terminal 25.

Note that each of the transistors is an element having at least threeterminals of a gate, a drain, and a source. Each transistor has achannel between the drain and the source, and current can flow throughthe drain, the channel, and the source. Here, since the source and thedrain of the transistor may change depending on the structure, theoperating condition, and the like of the transistor, it is difficult todefine which is a source or a drain. Thus, in this embodiment, a sourceand a drain are referred to as a first terminal and a second terminal,in some cases.

Here, the operation of the pulse signal output circuit illustrated inFIG. 4A will be described.

In the pulse signal output circuit illustrated in FIG. 4A, after a startpulse SP is supplied to the first input terminal 21, the clock signalCLK is supplied to the second input terminal 22. That is, an H-levelpotential and an L-level potential are alternately applied to the firstterminal of the transistor 104 which is electrically connected to thesecond input terminal 22, at regular intervals.

Since the clock signal CLK is supplied to the transistor 104 for a longtime, a load on the transistor 104 is larger than that on the othertransistors. For example, when a first terminal of the transistor 104 isa drain electrode, an H level of the clock signal, that is, the firsthigh power supply potential (VDD) is intermittently applied to the drainelectrode. This might result in negative shift of the threshold voltageof the transistor 104.

On the other hand, while the first low power potential VSS is applied tothe first input perminal 21, the pulse signal output circuit illustratedin FIG. 4A uses the second low power supply potential VEE, which islower than the first low power supply potential VSS, to apply to thegate electrode of the transistor 104 through the transistor 105 andtransistor 106. Thus, a stable pulse signal can be output even when thethreshold voltage of the transistor 104 shifts in the negativedirection. For example, the second low power supply potential VEE can belower than an L-level potential.

Note that the total potential of the threshold voltage Vth of thetransistor 102 and the second low power supply potential VEE ispreferably higher than the first low power supply potential VSS. Withsuch a structure, it is possible to prevent shoot-through current whichmight flow through the wiring 122 when the first low power supplypotential VSS is applied to the first input terminal 21.

To prevent the shoot-through current, a pulse signal output circuit mayhave a structure illustrated in FIG. 4B.

A pulse signal output circuit illustrated in FIG. 4B includes twotransistors 102 of the pulse signal output circuit illustrated in FIG.4A. Specifically, the pulse signal output circuit illustrated in FIG. 4Bincludes a transistor 102_1 and a transistor 1022, instead of thetransistor 102.

Note that the total potential of the threshold voltage Vth1 of thetransistor 102_1, the threshold voltage Vth2 of the transistor 1022, andthe second low power supply potential VEE is preferably higher than thefirst low power supply potential VSS.

With the transistor 102_1 and the transistor 102_2, a potentialcorresponding to the total threshold voltage Vth of the two transistorscan be higher than the first low power supply potential VSS, wherebyshoot-through current which might flow through the wiring 122 can beprevented. Note that the number of the transistors 102 is not limitedthereto, and can be three or more, for example.

The W/L of the transistor 116 is preferably larger than the W/L of thetransistor 114. Note that L represents the channel length of atransistor, and W represents the channel width of a transistor. Thissubstantially means that the resistance of the transistor 116 is madelower than that of the transistor 114. Thus, a circuit 130 illustratedin FIG. 4A can function as an inverter.

Next, an example of a method for driving the shift register illustratedin FIG. 3B will be described with reference to a timing chart of FIG. 5.

In the timing chart of FIG. 5 the clock signal CLK2 is delayed from theclock signal CLK1 by ¼ cycle, the clock signal CLK3 is delayed from theclock signal CLK2 by ¼ cycle, and the clock signal CLK4 is delayed fromthe clock signal CLK3 by ¼ cycle. In addition, the pulse width of thestart pulse signal SP is the same as the pulse width of the clocksignals CLK1 to CLK4.

The start pulse signal SP is set to an H level in time T1, then thefirst clock signal (CLK1) is set to an H level in time T2. Further, thefirst pulse signal output circuit 10_1 to the fifth pulse signal outputcircuit 10_5 are subsequently output a first output signal OUT[1] to afifth output signal OUT[5], respectively, in accordance with the firstclock signal (CLK1) to a fourth clock signal (CLK4). In time T7, a resetsignal R is set to an L level.

The above is the description of the example of the method for drivingthe shift register illustrated in FIG. 3B.

As described with reference to FIGS. 1A to 1C, FIGS. 2A to 2F, FIGS. 3Aand 3B, FIGS. 4A and 4B, and FIG. 5, in an example of the pulse signaloutput circuit of this embodiment, the second low power supply potentialVEE which is lower than the first low power supply potential VSS is usedto apply a negative potential to a gate electrode of a transistor.Accordingly, even when the threshold voltage of the transistor shifts inthe negative direction, a pulse signal output circuit which stablyoperates can be obtained.

The structure described in this embodiment can be used in appropriatecombination with the structure described in any of the otherembodiments.

Embodiment 2

In this embodiment, examples of a display device using the pulse signaloutput circuit in Embodiment 1 will be described with reference to FIGS.6A to 6C, FIG. 7, and FIG. 8.

A display device illustrated in FIG. 6A includes a pixel section 201 anda driver circuit section 202.

The pixel section 201 includes a plurality of pixel circuits 211arranged in x rows (x is a natural number of 2 or more) and y columns (yis a natural number of 2 or more). The driver circuit section 202includes driver circuits such as a gate driver 221 and a source driver223.

The gate driver 221 includes a shift register having a plurality ofstages of the pulse signal output circuits in Embodiment 1. For example,the gate driver 221 has a function of controlling potentials of scanlines GL_1 to GL_x in accordance with a pulse signal output from theshift register. Note that a plurality of gate drivers 221 may beprovided to separately control the scan lines GL_1 to GL_x.

Image signals are input to the source driver 223. The source driver 223has a function of generating data signals written in the pixel circuits211 based on the image signals. The source driver 223 has a function ofcontrolling potentials of data lines DL_1 to DL_y.

The source driver 223 is formed using a plurality of analog switches orthe like, for example. The source driver 223 can output signals obtainedby time-dividing the image signal as the data signals by sequentiallyturning on the plurality of analog switches. The source driver 223 maybe formed using a shift register or the like. In this case, as the shiftregister, a shift register including a plurality of stages of the pulsesignal output circuits described in Embodiment 1 can be used.

A pulse signal and a data signal are input to one of the plurality ofpixel circuits 211 through one of the plurality of scan lines GL and oneof the plurality of data lines DL, respectively. Writing and holding ofthe data signal in each of the plurality of pixel circuits 211 areperformed by the gate driver 221. For example, to the pixel circuit 211in m-th row and n-th column (m is a natural number of less than or equalto x, and n is a natural number of less than or equal to y), a pulsesignal is input from the gate driver 221 through the scan line GL_m, anda data signal is input from the source driver 223 through the data lineDL_n depending on the potential of the scan line GL_m.

As illustrated in FIG. 6B, the plurality of pixel circuits 211 eachincludes a liquid crystal element 230, a transistor 231_1, and acapacitor 233_1, for example.

The potential of one of a pair of electrodes of the liquid crystalelement 230 is set according to the specifications of the pixel circuit211 as appropriate. The alignment state of the liquid crystal element230 depends on written data. A common potential may be applied to one ofthe pair of electrodes of the liquid crystal element 230 included ineach of the plurality of pixel circuits 211. Alternatively, differentpotentials may be applied to one of the pair of electrodes of the liquidcrystal elements 230 included in the pixel circuits 211 on row-by-rowbasis.

As a display mode of the display device including a liquid crystalelement, any of the following modes can be used, for example: a TN(twisted nematic) mode, an IPS (in-plane-switching) mode, an STN (supertwisted nematic) mode, a VA (vertical alignment) mode, an ASM (axiallysymmetric aligned micro-cell) mode, an OCB (optically compensatedbirefringence) mode, an FLC (ferroelectric liquid crystal) mode, an AFLC(antiferroelectric liquid crystal) mode, an MVA (multi-domain verticalalignment) mode, a PVA (patterned vertical alignment) mode, an FFS(fringe field switching) mode, a TBA (transverse bend alignment) mode,and the like.

The liquid crystal element may be formed using a liquid crystalcomposition including a liquid crystal exhibiting a blue phase and achiral material. The liquid crystal exhibiting a blue phase has a shortresponse time of 1 msec or less and is optically isotropic; therefore,alignment treatment is not necessary and viewing angle dependence issmall.

In the pixel circuit 211 in the m-th row and the n-th column, a firstterminal of the transistor 231_1 is electrically connected to the dataline DL_n, and a second terminal of the transistor 231_1 is electricallyconnected to the other of the pair of electrodes of the liquid crystalelement 230. A gate of the transistor 231_1 is electrically connected tothe scan line GL_m. The transistor 231_1 has a function of controllingwhether to write a data signal by being turned on or off.

One of a pair of electrodes of the capacitor 233_1 is electricallyconnected to a potential supply line VL, and the other of the pair ofelectrodes of the capacitor 233_1 is electrically connected to the otherof the pair of electrodes of the liquid crystal element 230. Thepotential of the potential supply line VL is set according to thespecifications of the pixel circuit 211 as appropriate. The capacitor233_1 has a function as a storage capacitor for retaining written data.

In the display device including the pixel circuit 211 illustrated inFIG. 6B, the pixel circuits 211 are sequentially selected row by row bythe gate driver 221, whereby the transistors 231_1 are turned on and adata signal is written.

When the transistors 231_1 are turned off, the pixel circuits 211 inwhich the data has been written are brought into a holding state. Thisoperation is sequentially performed row by row; thus, an image isdisplayed.

The pixel circuit 211 illustrated in FIG. 6C includes a transistor231_2, a capacitor 233_2, a transistor 234, and a light-emitting element235.

A first terminal of the transistor 231_2 is electrically connected tothe data line DL_n. A gate of the transistor 231_2 is electricallyconnected the scan line GL_m.

The transistor 231_2 has a function of controlling whether to write adata signal by being turned on or off.

One of a pair of electrodes of the capacitor 233_2 is electricallyconnected to a power supply line VL_a, and the other of the pair ofelectrodes of the capacitor 233_2 is electrically connected to a secondterminal of the transistor 231_2.

The capacitor 233_2 has a function as a storage capacitor for retainingwritten data.

A first terminal of the transistor 234 is electrically connected to thepower supply line VL_a. Further, a gate of the transistor 234 iselectrically connected to the second terminal of the transistor 2312.

One of an anode and a cathode of the light-emitting element 235 iselectrically connected to a power supply line VL_b, and the other of theanode and the cathode of the light-emitting element 235 is electricallyconnected to a second terminal of the transistor 234.

The light-emitting element 235 may be an organic electroluminescentelement (also referred to as organic EL element) or the like, forexample. Note that the light-emitting element 235 is not limited theretoand may be an inorganic EL element containing an inorganic material.

The first high power supply potential VDD is applied to one of the powersupply line VL_a and the power supply line VL_b, and the first low powersupply potential VSS is applied to the other of the power supply lineVL_a and the power supply line VL_b.

In the display device including the pixel circuit 211 illustrated inFIG. 6C, the pixel circuits 211 are sequentially selected row by row bythe gate driver 221, whereby the transistors 231_2 are turned on and adata signal is written.

When the transistors 231_2 are turned off, the pixel circuits 211 inwhich the data has been written are brought into a holding state.Further, the amount of current flowing between the source and the drainof the transistor 234 is controlled depending on the potential of thewritten data signal. The light-emitting element 235 emits light with aluminance corresponding to the amount of flowing current. This operationis sequentially performed row by row; thus, an image is displayed.

An example of a method for driving the display device illustrated inFIG. 6A in the case where the display device can be operated in a lowpower consumption mode will be described with reference to a timingchart of FIG. 7. Here, a case of using the shift register described inEmbodiment 1 as the gate driver 221 is described as an example.

The display device illustrated in FIG. 6A is operated in a normal modeor a low power consumption mode.

The operation in the normal mode is described. In the normal mode, whena start pulse signal SP, a power supply voltage PWR, and clock signalsCLK1 to CLK4 are input to the shift register as shown in a period 311 inFIG. 7, the shift register sequentially outputs pulses of output signalsOUT_1 to OUT_n in accordance with a pulse of the start pulse signal SP.Note that the power supply voltage PWR is a power supply voltageconsisting of the first high power supply potential VDD and the firstlow power supply potential VSS or a power supply voltage consisting ofthe second high power supply potential VCC, the first low power supplypotential VSS, and the second low power supply potential VEE.

Next, the operation for changing from the normal mode to the low powerconsumption mode is described. In this case, as shown in a period 312 inFIG. 7, the input of the power supply voltage PWR, the clock signalsCLK1 to CLK4, and the start pulse signal SP to the shift register isstopped.

In this case, it is preferable to stop the input of the start pulsesignal SP to the shift register at first, then stop the input of theclock signals CLK1 to CLK4 sequentially, and stop the input of the powersupply voltage PWR. Thus, a malfunction of the shift register can beprevented.

When the input of the power supply voltage PWR, the clock signals CLK1to CLK4, and the start pulse signal SP to the shift register is stopped,the output of the pulses of the output signals OUT_1 to OUT_n isstopped. Thus, the display changes to the low power consumption mode.

To change the shift register back to the normal mode, as shown in aperiod 313 in FIG. 7, the input of the start pulse signal SP, the clocksignals CLK1 to CLK4, and the power supply voltage PWR to the shiftregister is restarted.

In this period, the input of the power supply voltage PWR to the shiftregister is restarted first; next, the input of the clock signals CLK1to CLK4 is restarted; and then the input of the start pulse signal SP isrestarted. Moreover, in this case, it is preferable to restart inputtingthe clock signals CLK1 to CLK4 sequentially after the potentials of thewirings through which the clock signals CLK1 to CLK4 are input are setto the first high power supply potential VDD.

When the input of the start pulse signal SP, the clock signals CLK1 toCLK4, and the power supply voltage PWR to the shift register isrestarted, the shift register sequentially outputs pulses of the outputsignals OUT_1 to OUT_n in accordance with a pulse of the start pulsesignal SP. Thus, the display device changes back to the normal mode.

The above is description of an example of the display device in thisembodiment.

As described with reference to FIG. 7, in an example of the displaydevice of this embodiment, the operation of a driver circuit including ashift register can be stopped as necessary. Therefore, for example, indisplaying images by using pixel circuits including transistors with lowoff-state current, in the case where rewriting of data signals is notnecessary in part or the whole, the operation of a driver circuit can bestopped to increase the rewriting interval. Accordingly, powerconsumption can be reduced.

As illustrated in FIG. 8, a protection circuit 225 may be connectedbetween the gate driver 221 and the pixel circuit 211 (to the scan lineGL). Further, another protection circuit 225 may be connected betweenthe source driver 223 and the pixel circuit 211 (to the data line DL).Each of the protection circuits 225 is a circuit which electricallyconnects another power supply line to a wiring to which the protectioncircuit itself is connected when a potential out of a certain range isapplied to the wiring. The protection circuits 225 include a diode orthe like, for example.

By providing protection circuits as illustrated in FIG. 8, tolerance toovervoltage generated by electro static discharge (ESD) or the like canbe increased in the display device.

As described above, in an example of the display device of thisembodiment, driver circuits such as the gate driver and the sourcedriver can be formed using the pulse signal output circuit described inEmbodiment 1. In these driver circuits, since stable pulses are suppliedfrom a pulse signal output circuit, the display device can have highreliability.

Embodiment 3

In this embodiment, examples of a structure of a display deviceincluding the pulse signal output circuit of Embodiment 1 will bedescribed with reference to FIGS. 9A and 9B.

First, the display device illustrated in FIG. 9A will be describedbelow.

The display device illustrated in FIG. 9A includes the pixel section 201and the driver circuit section 202, which are in the display deviceillustrated in FIG. 6A. FIG. 9A shows a liquid crystal display deviceusing a vertical electric field mode.

In the display device described in this embodiment, a liquid crystalelement is sandwiched between a pair of substrates (a substrate 400 anda substrate 430).

Conductive layers 402 a and 402 b are formed over the substrate 400. Theconductive layer 402 a is formed in the driver circuit section 202 andhas a function as a gate of a transistor in a driver circuit. Theconductive layer 402 b is formed in the pixel section 201 and has afunction as a gate of a transistor in a pixel circuit.

An insulating layer 404 is formed over the substrate 400, the conductivelayer 402 a, and the conductive layer 402 b. The insulating layer 404has functions as a gate insulating layer of the transistor in the drivercircuit and a gate insulating layer of the transistor in the pixelcircuit.

Semiconductor layers 406 a and 406 b are formed over the insulatinglayer 404. The semiconductor layer 406 a is formed to overlap with theconductive layer 402 a and has a function as a channel of the transistorin the driver circuit. The semiconductor layer 406 b is formed tooverlap with the conductive layer 402 b and has a function as a channelof the transistor in the pixel circuit.

Conductive layers 408 a, 408 b, 408 c, and 408 d are formed over theinsulating layer 404, the semiconductor layer 406 a, and thesemiconductor layer 406 b. The conductive layer 408 a is electricallyconnected to the semiconductor layer 406 a and has a function as a firstterminal of the transistor in the driver circuit. The conductive layer408 b is electrically connected to the semiconductor layer 406 a and hasa function as a second terminal of the transistor in the driver circuit.The conductive layer 408 c is electrically connected to thesemiconductor layer 406 b and has a function as a first terminal of thetransistor in the pixel circuit. The conductive layer 402 d iselectrically connected to the semiconductor layer 406 b and has afunction as a second terminal of the transistor in the pixel circuit.

An insulating layer 410 is formed over the insulating layer 404, thesemiconductor layer 406 a, the semiconductor layer 406 b, the conductivelayer 408 a, the conductive layer 408 b, the conductive layer 408 c, andthe conductive layer 408 d. The insulating layer 410 has a function ofprotecting the transistors, in particular, the semiconductor layers 406a and 406 b.

An insulating layer 412 is formed over the insulating layer 410. Theinsulating layer 412 has a function of protecting the transistors.

An insulating layer 414 is formed over the insulating layer 412. Theinsulating layer 414 has a function as a planarization layer. Formingthe insulating layer 414 enables prevention of parasitic capacitancebetween conductive layers below and above the insulating layer 414.

Conductive layers 416 a and 416 b are formed over the insulating layer414. The conductive layer 416 a overlaps with the semiconductor layer406 a with the insulating layers 410, 412, and 414 laid therebetween andhas a function as a back gate of the transistor in the driver circuit.For example, in the case of an n-channel transistor, application of anegative potential to the back gate enables the threshold voltage of thetransistor to shift in the positive direction. Note that a groundpotential (also referred to as GND) may be applied to the conductivelayer 416 a or it is also possible not to provide the conductive layer416 a. The conductive layer 416 b has a function as one of a pair ofelectrodes of a capacitor in the pixel circuit.

An insulating layer 418 is formed over the insulating layer 414, theconductive layer 416 a, and the conductive layer 416 b. The insulatinglayer 418 has functions as a protective insulating layer of thetransistors and a dielectric layer of the capacitor in the pixelcircuit. Note that it is preferable that the insulating layer 418 be notformed over the driver circuit section 202 as illustrated in FIG. 9A.With the structure where the insulating layer 418 is not formed over thedriver circuit section 202, moisture, impurities, or the like containedin the insulating layer 414 can be released to the outside.

A conductive layer 420 is formed over the insulating layer 418. Theconductive layer 420 is electrically connected to the conductive layer408 d through an opening penetrating the insulating layers 410, 412,414, and 418, and overlaps with the conductive layer 416 b with theinsulating layer 418 laid therebetween. Further, the conductive layer420 has functions as one of a pair of electrodes of the liquid crystalelement in the pixel circuit and the other of the pair of electrodes ofthe capacitor.

A coloring layer 426 is formed over the substrate 430. The coloringlayer 426 has a function as a color filter. Although not illustrated inFIGS. 9A and 9B, a light-blocking film having a function as a blackmatrix can be formed adjacent to the coloring layer 426.

An insulating layer 424 is formed over the coloring layer 426. Theinsulating layer 424 has a function as a planarization layer or afunction of preventing impurities contained in the coloring layer 426from being diffused into the liquid crystal element.

A conductive layer 422 is formed over the insulating layer 424. Theconductive layer 422 has a function as the other of the pair ofelectrodes of the liquid crystal element in the pixel circuit. Note thatan insulating film having a function as an alignment film may beadditionally formed over the conductive layer 422 and the conductivelayer 420.

A liquid crystal layer 428 is formed between the conductive layer 420and the conductive layer 422. The liquid crystal layer 428 is sealedbetween the substrate 400 and the substrate 430 with a sealing material432. The sealing material 432 is preferably in contact with an inorganicmaterial to prevent entrance of moisture or the like from the outside.In this embodiment, the sealing material 432 is in contact with theinsulating layer 412 and the substrate 430, for example.

Next, a display device illustrated in FIG. 9B will be described below.

The display device illustrated in FIG. 9B is a display device using ahorizontal electric field mode (FFS mode). Unlike the display deviceillustrated in FIG. 9A, the display device illustrated in FIG. 9Badditionally includes a conductive layer 402 c, a conductive layer 416 cinstead of the conductive layer 416 b, a conductive layer 421 instead ofthe conductive layer 420, and a liquid crystal layer 429 instead of theliquid crystal layer 428, and does not have the conductive layer 422. Asfor the same portions as those of the display device illustrated in FIG.9A, the display device illustrated in FIG. 9A is referred to.

The conductive layer 402 c is formed over the substrate 400 through thesame step as the conductive layer 402 a and the conductive layer 402 band overlaps with the conductive layer 408 d with the insulating layer404 laid therebetween. A capacitor can be formed by using the conductivelayer 402 c, part of the insulating layer 404, and part of theconductive layer 408 d. The conductive layer 402 c has a function as oneof the pair of electrodes of the capacitor, the part of the insulatinglayer 404 has a function as a dielectric, and the part of the conductivelayer 408 d has a function as the other of the pair of electrodes of thecapacitor.

The conductive layer 416 c is formed over the insulating layer 414. Theconductive layer 416 c has functions as the one of the pair ofelectrodes of the liquid crystal element in the pixel circuit and theone of the pair of electrodes of the capacitor in the pixel circuit.

The conductive layer 421 is formed over the insulating layer 418 and iselectrically connected to the conductive layer 408 d through an openingpenetrating the insulating layers 410, 412, 414, and 418. The conductivelayer 421 has a comb-shaped portion. Each of teeth of the comb-shapedportion overlaps with the conductive layer 416 c with the insulatinglayer 418 laid therebetween. The conductive layer 421 has functions asthe other of the pair of electrodes of the liquid crystal element in thepixel circuit and the other of the pair of electrodes of the capacitorin the pixel circuit.

The liquid crystal layer 429 is formed between the conductive layer 421and the insulating layer 424 and is sealed with the sealing material432.

In this embodiment, the transistor is a bottom-gate transistor; however,the transistor is not limited thereto and may be a top-gate transistor,for example. In this embodiment, the bottom-gate transistor is what iscalled, a channel-etch type transistor where a channel is not protected,for example. However, the bottom-gate transistor is not limited theretoand may be what is called, a channel protection transistor where aninsulating film is formed to protect the channel, for example.

Next, components of the display devices illustrated in FIGS. 9A and 9Bwill be described below in detail.

As each of the substrates 400 and 430, a glass substrate ofaluminosilicate glass, aluminoborosilicate glass, or barium borosilicateglass, or a plastic substrate can be used, for example. In the massproduction, for the substrates 400 and 430, a mother glass with any ofthe following sizes is preferably used: the 8-th generation (2160mm×2460 mm), the 9-th generation (2400 mm×2800 mm, or 2450 mm×3050 mm),the 10-th generation (2950 mm×3400 mm), and the like. High processtemperature and a long period of process time drastically shrink themother glass. High process temperature and a long period of process timedrastically shrink the mother glass. Thus, in the case where massproduction is performed with the use of the mother glass, it ispreferable that the heat process in the manufacturing process bepreferably performed at a temperature lower than or equal to 600° C.,further preferably lower than or equal to 450° C., still furtherpreferably lower than or equal to 350° C.

A base insulating layer may be provided between the substrate 400 andthe conductive layers 402 a, 402 b, and 402 c. As the base insulatinglayer, a silicon oxide film, a silicon oxynitride film, a siliconnitride film, a silicon nitride oxide film, a gallium oxide film, ahafnium oxide film, an yttrium oxide film, an aluminum oxide film, analuminum oxynitride film, and the like can be given as examples. Notethat when a silicon nitride film, a gallium oxide film, a hafnium oxidefilm, an yttrium oxide film, an aluminum oxide film, or the like is usedas the base insulating layer, it is possible to suppress entry ofimpurities such as an alkali metal, water, and hydrogen from thesubstrate 400 into the semiconductor layers 406 a and 406 b.

For the conductive layers 402 a, 402 b, and 402 c, a metal elementselected from the group of aluminum, chromium, copper, tantalum,titanium, molybdenum, and tungsten, an alloy containing any of thesemetal elements as a component, an alloy containing these metal elementsin combination, or the like can be used. Further, one or more metalelements selected from manganese or zirconium may be used. Theconductive layers 402 a, 402 b, and 402 c may have a single-layerstructure or a stacked-layer structure having two or more layers. Forexample, a single-layer structure of an aluminum film containingsilicon, a two-layer structure in which a titanium film is stacked overan aluminum film, a two-layer structure in which a titanium film isstacked over a titanium nitride film, a two-layer structure in which atungsten film is stacked over a titanium nitride film, a two-layerstructure in which a tungsten film is stacked over a tantalum nitridefilm or a tungsten nitride film, a three-layer structure in which atitanium film, an aluminum film, and a titanium film are stacked in thisorder, and the like can be given. Alternatively, a film, an alloy film,or a nitride film which contains aluminum and one or more elementsselected from titanium, tantalum, tungsten, molybdenum, chromium,neodymium, and scandium may be used.

Alternatively, the conductive layers 402 a, 402 b, and 402 c can beformed using a light-transmitting conductive material such as indium tinoxide, indium oxide containing tungsten oxide, indium zinc oxidecontaining tungsten oxide, indium oxide containing titanium oxide,indium tin oxide containing titanium oxide, indium zinc oxide, or indiumtin oxide to which silicon oxide is added. It is also possible to have astacked-layer structure formed using the above light-transmittingconductive material and the above metal element.

As the insulating layer 404, a single layer or a stacked layer of, forexample, a silicon oxide film, a silicon oxynitride film, a siliconnitride oxide film, a silicon nitride film, an aluminum oxide film, ahafnium oxide film, a gallium oxide film, a Ga—Zn-based metal oxidefilm, a silicon nitride film, a silicon nitride oxide film, or the likecan be provided. To improve the properties of the interface with thesemiconductor layers 406 a and 406 b, at least a region of theinsulating layer 404, which is in contact with the semiconductor layers406 a and 406 b, is preferably formed with an oxide insulating film.

Further, by providing an insulating film having a blocking effectagainst oxygen, hydrogen, water, and the like over the insulating layer404, it is possible to prevent outward diffusion of oxygen from thesemiconductor layers 406 a and 406 b and entry of hydrogen, water, orthe like into the semiconductor layers 406 a and 406 b from the outside.As the insulating film that can block oxygen, hydrogen, water, and thelike, an aluminum oxide film, an aluminum oxynitride film, a galliumoxide film, a gallium oxynitride film, an yttrium oxide film, an yttriumoxynitride film, a hafnium oxide film, a hafnium oxynitride film, andthe like can be given.

The insulating layer 404 can be formed as a gate insulating film whichhas few defects and releases less hydrogen and less ammonia, when formedto have a stacked structure in which a silicon nitride film having fewdefects is used as a first silicon nitride film, a silicon nitride filmwhich releases less hydrogen and less ammonia is provided as a secondsilicon nitride film over the first silicon nitride film, and an oxideinsulating film is provided over the second silicon nitride film. Thus,transfer of hydrogen and nitrogen, which are contained in the insulatinglayer 404, to the semiconductor layers 406 a and 406 b can besuppressed.

The use of a silicon nitride film as the insulating layer 404 has thefollowing effect. The silicon nitride film has a higher relativepermittivity than a silicon oxide film and needs a larger thickness foran equivalent capacitance. Thus, the physical thickness of the gateinsulating film can be increased. This makes it possible to reduce adecrease in withstand voltage of a transistor and furthermore increasethe withstand voltage, thereby reducing electrostatic discharge damageto the transistor used in a display device.

Further, in the case where copper is used for the conductive layers 402a, 402 b, and 402 c and a silicon nitride film is used as the insulatinglayer 404 in contact with the conductive layers 402 a, 402 b, and 402 c,the number of the ammonia molecules released from the silicon nitridefilm by heating is preferably reduced as much as possible so thatreaction between copper and the ammonia molecules can be suppressed.

The insulating layer 404 may be formed using a high-k material such ashafnium silicate (HfSiO_(x)), hafnium silicate to which nitrogen isadded (HfSi_(x)O_(y)N_(z)), hafnium aluminate to which nitrogen is added(HfAl_(x)O_(y)N_(z)), hafnium oxide, or yttrium oxide, so that gateleakage current of the transistor can be reduced.

The thickness of the insulating layer 404 is greater than or equal to 5nm and less than or equal to 400 nm, preferably greater than or equal to10 nm and less than or equal to 300 nm, more preferably greater than orequal to 50 nm and less than or equal to 250 nm.

The semiconductor layers 406 a and 406 preferably include an oxidesemiconductor containing at least indium (In) or zinc (Zn).Alternatively, the semiconductor layers 406 a and 406 preferablycontains both In and Zn. In order to reduce variation in electricalcharacteristics of the transistor including the oxide semiconductor, theoxide semiconductor preferably contains one or more of stabilizers inaddition to In and/or Zn.

As a stabilizer, gallium (Ga), tin (Sn), hafnium (Hf), aluminum (Al),zirconium (Zr), and the like can be given. As another stabilizer,lanthanoid such as lanthanum (La), cerium (Ce), praseodymium (Pr),neodymium (Nd), samarium (Sm), europium (Eu), gadolinium (Gd), terbium(Tb), dysprosium (Dy), holmium (Ho), erbium (Er), thulium (Tm),ytterbium (Yb), or lutetium (Lu) can be given.

As the oxide semiconductor, for example, any of the following can beused: indium oxide, tin oxide, zinc oxide, an In—Zn-based oxide, aSn—Zn-based oxide, an Al—Zn-based oxide, a Zn—Mg-based oxide, aSn—Mg-based oxide, an In—Mg-based oxide, an In—Ga-based oxide, anIn—Ga—Zn-based oxide, an In—Al—Zn-based oxide, an In—Sn—Zn-based oxide,a Sn—Ga—Zn-based oxide, an Al—Ga—Zn-based oxide, a Sn—Al—Zn-based oxide,an In—Hf—Zn-based oxide, an In—La—Zn-based oxide, an In—Ce—Zn-basedoxide, an In—Pr—Zn-based oxide, an In—Nd—Zn-based oxide, anIn—Sm—Zn-based oxide, an In—Eu—Zn-based oxide, an In—Gd—Zn-based oxide,an In—Tb—Zn-based oxide, an In—Dy—Zn-based oxide, an In—Ho—Zn-basedoxide, an In—Er—Zn-based oxide, an In—Tm—Zn-based oxide, anIn—Yb—Zn-based oxide, an In—Lu—Zn-based oxide, an In—Sn—Ga—Zn-basedoxide, an In—Hf—Ga—Zn-based oxide, an In—Al—Ga—Zn-based oxide, anIn—Sn—Al—Zn-based oxide, an In—Sn—Hf—Zn-based oxide, or anIn—Hf—Al—Zn-based oxide.

For the above-listed metal oxides, an In—Ga—Zn-based metal oxide, forexample, is an oxide whose main components are In, Ga, and Zn, and thereis no particular limitation on the ratio of In:Ga:Zn. The In—Ga—Zn-basedoxide may contain a metal element other than the In, Ga, and Zn.

Alternatively, a material represented by InMO₃ (ZnO)_(m) (m>0 issatisfied, and M is not an integer) may be used as an oxidesemiconductor. Note that M represents one or more metal elementsselected from Ga, Fe, Mn, and Co. Alternatively, as the oxidesemiconductor, a material represented by a chemical formula, In₂SnO₅(ZnO)_(n) (n>0, n is a natural number) may be used.

For example, an In—Ga—Zn-based metal oxide with an atomic ratio whereIn:Ga:Zn=1:1:1, In:Ga:Zn=2:2:1, or In:Ga:Zn=3:1:2, or an oxide with anatomic ratio close to the above atomic ratios can be used.Alternatively, an In—Sn—Zn-based oxide with an atomic ratio ofIn:Sn:Zn=1:1:1, In:Sn:Zn=2:1:3, or In:Sn:Zn=2:1:5 may be used. Note thata proportion of each atom in the atomic ratio of the metal oxide varieswithin a range of ±20% as an error.

However, without limitation to the materials given above, a materialwith an appropriate composition may be used in accordance with neededsemiconductor characteristics and electric characteristics (e.g.,field-effect mobility and the threshold voltage). In order to obtainnecessary semiconductor characteristics, it is preferable that thecarrier density, the impurity concentration, the defect density, theatomic ratio of a metal element to oxygen, the interatomic distance, thedensity, and the like be set to be appropriate.

For example, high mobility can be obtained relatively easily in the casewhere an In—Sn—Zn-based metal oxide is used. Also in the case where anIn—Ga—Zn-based metal oxide is used, the field-effect mobility can beincreased by reducing the defect density in a bulk.

Further, the energy gap of an oxide semiconductor film that can be usedas the semiconductor layers 406 a and 406 b is 2 eV or higher,preferably 2.5 eV or higher, more preferably 3 eV or higher. Theoff-state current of a transistor can be reduced by using an oxidesemiconductor film having a wide energy gap.

Note that the oxide semiconductor film that can be used as thesemiconductor layers 406 a and 406 b is preferably formed by asputtering method. As a sputtering method, an RF sputtering method, a DCsputtering method, an AC sputtering method, or the like can be used. Inparticular, a DC sputtering method is preferably used because dustgenerated in the deposition can be reduced and the film thickness can beuniform.

Here, the structure of an oxide semiconductor film which is used as thesemiconductor layers 406 a and 406 b is described.

An oxide semiconductor film is classified roughly into a single-crystaloxide semiconductor film and a non-single-crystal oxide semiconductorfilm. The non-single-crystal oxide semiconductor film includes any of ac-axis aligned crystalline oxide semiconductor (CAAC-OS) film, apolycrystalline oxide semiconductor film, a microcrystalline oxidesemiconductor film, an amorphous oxide semiconductor film, and the like.

First, a CAAC-OS film will be described.

The CAAC-OS film is one of oxide semiconductor films having a pluralityof c-axis aligned crystal parts.

In a transmission electron microscope (TEM) image of the CAAC-OS film, aboundary between crystal parts, that is, a grain boundary is not clearlyobserved. Thus, in the CAAC-OS film, a reduction in electron mobilitydue to the grain boundary is less likely to occur.

According to the TEM image of the CAAC-OS film observed in a directionsubstantially parallel to a sample surface (cross-sectional TEM image),metal atoms are arranged in a layered manner in the crystal parts. Eachmetal atom layer has a morphology reflected by a surface over which theCAAC-OS film is formed (hereinafter, a surface over which the CAAC-OSfilm is formed is referred to as a formation surface) or a top surfaceof the CAAC-OS film, and is arranged in parallel to the formationsurface or the top surface of the CAAC-OS film.

On the other hand, according to the TEM image of the CAAC-OS filmobserved in a direction substantially perpendicular to the samplesurface (plan TEM image), metal atoms are arranged in a triangular orhexagonal configuration in the crystal parts. However, there is noregularity of arrangement of metal atoms between different crystalparts.

From the results of the cross-sectional TEM image and the plan TEMimage, alignment is found in the crystal parts in the CAAC-OS film.

In this specification, a term “parallel” indicates that the angle formedbetween two straight lines is greater than or equal to −10° and lessthan or equal to 10°, and accordingly also includes the case where theangle is greater than or equal to −5° and less than or equal to 5°. Inaddition, a term “perpendicular” indicates that the angle formed betweentwo straight lines is from 80° to 100°, and accordingly includes a casewhere the angle is from 85° to 95°.

Most of the crystal parts included in the CAAC-OS film each fit inside acube whose one side is less than 100 nm. Thus, there is a case where acrystal part included in the CAAC-OS film fits a cube whose one side isless than 10 nm, less than 5 nm, or less than 3 nm. Note that when aplurality of crystal parts included in the CAAC-OS film are connected toeach other, one large crystal region is formed in some cases. Forexample, a crystal region with an area of 2500 nm² or more, 5 μm² ormore, or 1000 μm² or more is observed in some cases in the plan TEMimage.

A CAAC-OS film is subjected to structural analysis with an X-raydiffraction (XRD) apparatus. For example, when the CAAC-OS filmincluding an InGaZnO₄ crystal is analyzed by an out-of-plane method, apeak appears frequently when the diffraction angle (2θ) is around 31°.This peak is derived from the (009) plane of the InGaZnO₄ crystal, whichindicates that crystals in the CAAC-OS film have c-axis alignment, andthat the c-axes are aligned in a direction substantially perpendicularto the formation surface or the top surface of the CAAC-OS film.

On the other hand, when the CAAC-OS film is analyzed by an in-planemethod in which an X-ray enters a sample in a direction substantiallyperpendicular to the c-axis, a peak appears frequently when 2θ is around56°. This peak is derived from the (110) plane of the InGaZnO₄ crystal.Here, analysis (ϕ scan) is performed under conditions where the sampleis rotated around a normal vector of a sample surface as an axis (ϕaxis) with 2θ fixed at around 56°. In the case where the sample is asingle-crystal oxide semiconductor film of InGaZnO₄, six peaks appear.The six peaks are derived from crystal planes equivalent to the (110)plane. On the other hand, in the case of a CAAC-OS film, a peak is notclearly observed even when ϕ scan is performed with 2θ fixed at around56°.

According to the above results, in the CAAC-OS film having c-axisalignment, while the directions of a-axes and b-axes are differentbetween crystal parts, the c-axes are aligned in a direction parallel toa normal vector of a formation surface or a normal vector of a topsurface. Thus, each metal atom layer arranged in a layered mannerobserved in the cross-sectional TEM image corresponds to a planeparallel to the a-b plane of the crystal.

Note that the crystal part is formed concurrently with deposition of theCAAC-OS film or is formed through crystallization treatment such as heattreatment.

As described above, the c-axis of the crystal is aligned with adirection parallel to a normal vector of a formation surface or a normalvector of a top surface. Thus, for example, in the case where a shape ofthe CAAC-OS film is changed by etching or the like, the c-axis might notbe necessarily parallel to a normal vector of a formation surface or anormal vector of a top surface of the CAAC-OS film.

Further, distribution of c-axis aligned crystal parts in the CAAC-OSfilm is not necessarily uniform. For example, in the case where crystalgrowth leading to the crystal parts of the CAAC-OS film occurs from thevicinity of the top surface of the film, the proportion of the c-axisaligned crystal parts in the vicinity of the top surface is higher thanthat in the vicinity of the formation surface in some cases. Further,when an impurity is added to the CAAC-OS film, a region to which theimpurity is added is altered, and the proportion of the c-axis alignedcrystal parts in the CAAC-OS film varies depending on regions, in somecases.

Note that when the CAAC-OS film with an InGaZnO₄ crystal is analyzed byan out-of-plane method, a peak of 2θ may also be observed at around 36°,in addition to the peak of 2θ at around 31°. The peak of 2θ at around36° indicates that a crystal having no c-axis alignment is included inpart of the CAAC-OS film. It is preferable that in the CAAC-OS film, apeak of 2θ appear at around 31° and a peak of 2θ do not appear at around36°.

The CAAC-OS film is an oxide semiconductor film having low impurityconcentration. The impurity is an element other than the main componentsof the oxide semiconductor film, such as hydrogen, carbon, silicon, or atransition metal element. In particular, an element that has higherbonding strength to oxygen than a metal element included in the oxidesemiconductor film, such as silicon, disturbs the atomic arrangement ofthe oxide semiconductor film by depriving the oxide semiconductor filmof oxygen and causes a decrease in crystallinity. Further, a heavy metalsuch as iron or nickel, argon, carbon dioxide, or the like has a largeatomic radius (molecular radius), and thus disturbs the atomicarrangement of the oxide semiconductor film and causes a decrease incrystallinity when it is contained in the oxide semiconductor film. Notethat the impurity contained in the oxide semiconductor film might serveas a carrier trap or a carrier generation source.

The CAAC-OS film is an oxide semiconductor film having a low density ofdefect states. In some cases, oxygen vacancies in the oxidesemiconductor film serve as carrier traps or serve as carrier generationsources when hydrogen is captured therein.

The state in which impurity concentration is low and density of defectstates is low (the number of oxygen vacancies is small) is referred toas a “highly purified intrinsic” or “substantially highly purifiedintrinsic” state. A highly purified intrinsic or substantially highlypurified intrinsic oxide semiconductor film has few carrier generationsources, and thus can have a low carrier density. Thus, a transistorincluding the oxide semiconductor film rarely has negative thresholdvoltage (is rarely normally-on). The highly purified intrinsic orsubstantially highly purified intrinsic oxide semiconductor film has alow density of defect states, and thus has few carrier traps.Accordingly, the transistor including the oxide semiconductor film haslittle variation in electrical characteristics and high reliability.Electric charge trapped by the carrier traps in the oxide semiconductorfilm takes a long time to be released, and might behave like fixedelectric charge. Thus, the transistor which includes the oxidesemiconductor film having high impurity concentration and a high densityof defect states has unstable electrical characteristics in some cases.

With the use of the CAAC-OS film in a transistor, variation in theelectrical characteristics of the transistor due to irradiation withvisible light or ultraviolet light is small.

Next, a microcrystalline oxide semiconductor film will be described.

In an image obtained with the TEM, crystal parts cannot be found clearlyin the microcrystalline oxide semiconductor in some cases. In mostcases, a crystal part in the microcrystalline oxide semiconductor isgreater than or equal to 1 nm and less than or equal to 100 nm, orgreater than or equal to 1 nm and less than or equal to 10 nm. Amicrocrystal with a size greater than or equal to 1 nm and less than orequal to 10 nm, or a size greater than or equal to 1 nm and less than orequal to 3 nm is specifically referred to as nanocrystal (nc). An oxidesemiconductor film including nanocrystal is referred to as an nc-OS(nanocrystalline oxide semiconductor) film. In an image obtained withTEM, a crystal grain cannot be found clearly in the nc-OS film in somecases.

In the nc-OS film, a microscopic region (for example, a region with asize greater than or equal to 1 nm and less than or equal to 10 nm, inparticular, a region with a size greater than or equal to 1 nm and lessthan or equal to 3 nm) has a periodic atomic order. Further, there is noregularity of crystal orientation between different crystal parts in thenc-OS film; thus, the orientation of the whole film is not observed.Accordingly, in some cases, the nc-OS film cannot be distinguished froman amorphous oxide semiconductor depending on an analysis method. Forexample, when the nc-OS film is subjected to structural analysis by anout-of-plane method with an XRD apparatus using an X-ray having adiameter larger than that of a crystal part, a peak which shows acrystal plane does not appear. Further, a halo pattern is shown in aselected-area electron diffraction pattern of the nc-OS film obtained byusing an electron beam having a probe diameter larger than the diameterof a crystal part (e.g., larger than or equal to 50 nm). Meanwhile,spots are shown in a nanobeam electron diffraction image of the nc-OSfilm obtained by using an electron beam having a probe diameter (e.g.,larger than or equal to 1 nm and smaller than or equal to 30 nm) closeto, or smaller than or equal to the diameter of a crystal part. Further,in a nanobeam electron diffraction image of the nc-OS film, regions withhigh luminance in a circular (ring) pattern are shown in some cases.Also in a nanobeam electron diffraction image of the nc-OS film, aplurality of spots are shown in a ring-like region in some cases.

Since the nc-OS film is an oxide semiconductor film having moreregularity than the amorphous oxide semiconductor film, the nc-OS filmhas a lower density of defect states than the amorphous oxidesemiconductor film. However, there is no regularity of crystalorientation between different crystal parts in the nc-OS film; hence,the nc-OS film has a higher density of defect states than the CAAC-OSfilm.

Note that an oxide semiconductor film may be a stacked film includingtwo or more films of an amorphous oxide semiconductor film, amicrocrystalline oxide semiconductor film, and a CAAC-OS film, forexample.

For the deposition of the CAAC-OS film, the following conditions arepreferably used.

By reducing the amount of impurities entering the CAAC-OS film duringthe deposition, the crystal state can be prevented from being broken bythe impurities. For example, the impurities (e.g., hydrogen, water,carbon dioxide, and nitrogen) which exist in the deposition chamber maybe reduced. Furthermore, impurities in a deposition gas may be reduced.Specifically, a deposition gas whose dew point is −80° C. or lower,preferably −100° C. or lower is used.

For example, the CAAC-OS film is formed with a polycrystalline oxidesemiconductor sputtering target by a sputtering method. When ionscollide with the sputtering target, a crystal region included in thesputtering target may be separated from the target along an a-b plane;in other words, a sputtered particle having a plane parallel to an a-bplane (flat-plate-like sputtered particle or pellet-like sputteredparticle) may flake off from the sputtering target. In that case, theflat-plate-like sputtered particle reaches a substrate while maintainingtheir crystal state, whereby the CAAC-OS film can be formed.

By increasing the substrate heating temperature during the deposition,migration of a sputtered particle is likely to occur after the sputteredparticle reaches a substrate surface. Specifically, the substrateheating temperature during the deposition is higher than or equal to100° C. and lower than or equal to 740° C., preferably higher than orequal to 200° C. and lower than or equal to 500° C. By increasing thesubstrate heating temperature during the deposition, when theflat-plate-like sputtered particle, for example, reaches the substratesurface, migration occurs on the substrate surface, so that a flat planeof the flat-plate-like sputtered particle, for example, is attached tothe substrate.

Furthermore, it is preferable that the proportion of oxygen in thedeposition gas be increased and the power be optimized in order toreduce plasma damage at the deposition. The proportion of oxygen in thedeposition gas is 30 vol % or higher, preferably 100 vol %.

The thickness of the oxide semiconductor film is preferably greater thanor equal to 1 nm and less than or equal to 100 nm, more preferablygreater than or equal to 1 nm and less than or equal to 30 nm, stillmore preferably greater than or equal to 1 nm and less than or equal to50 nm, further preferably greater than or equal to 3 nm and less than orequal to 20 nm.

In the oxide semiconductor film used as the semiconductor layers 406 aand 406 b, the concentration of an alkali metal or an alkaline earthmetal obtained by secondary ion mass spectrometry (SIMS) is preferablylower than or equal to 1×10¹⁸ atoms/cm³, more preferably lower than orequal to 2×10¹⁶ atoms/cm³. This is because an alkali metal and analkaline earth metal are bonded to an oxide semiconductor and generatecarriers in some cases and cause an increase in off-state current of thetransistor.

Further, the hydrogen concentration in the oxide semiconductor film usedas the semiconductor layers 406 a and 406 b, which is measured bysecondary ion mass spectrometry, is preferably lower than 5×10¹⁸atoms/cm³, more preferably 1×10¹⁸ atoms/cm³ or lower, still morepreferably 5×10¹⁷ atoms/cm³ or lower, further preferably 1×10¹⁶atoms/cm³ or lower.

Hydrogen contained in the oxide semiconductor film reacts with oxygenbonded to a metal atom to produce water, and a defect is formed in alattice from which oxygen is released (or a portion from which oxygen isremoved). In addition, a bond of part of hydrogen and oxygen causesgeneration of electrons serving as carrier. Thus, the impuritiescontaining hydrogen are reduced as much as possible in the step offorming the oxide semiconductor film, whereby the hydrogen concentrationin the oxide semiconductor film can be reduced. Therefore, an oxidesemiconductor film in which hydrogen is removed as much as possible isused in a channel formation region, whereby a shift of the thresholdvoltage in the negative direction can be suppressed and variation inelectrical characteristics can be reduced. Further, leakage currentbetween a source and a drain of the transistor, typically off-statecurrent, can be reduced.

In addition, the nitrogen concentration in the oxide semiconductor filmused as the semiconductor layers 406 a and 406 b is set to be lower thanor equal to 5×10¹⁸ atoms/cm³, whereby a shift of the threshold voltagein the negative direction can be suppressed and variation in electricalcharacteristics can be reduced.

Various experiments can prove low off-state current of a transistorincluding a highly-purified oxide semiconductor film from which hydrogenis removed as much as possible as a channel formation region. Forexample, even a transistor with a channel width of 1×10⁶ μm and achannel length of 10 μm can have an off-state current less than or equalto the measurement limit of a semiconductor parameter analyzer, that is,less than or equal to 1×10⁻¹³ A when the voltage (drain voltage) betweena source electrode and a drain electrode ranges between 1 V and 10 V. Inthis case, it can be seen that the off-state current corresponding to avalue obtained by dividing the off-state current by the channel width ofthe transistor is 100 zA/μm or lower. In addition, a capacitor and atransistor are connected to each other and the off-state current ismeasured with a circuit in which charge flowing into or from thecapacitor is controlled by the transistor. In the measurement, apurified oxide semiconductor film has been used for a channel formationregion of the transistor, and the off-state current of the transistorhas been measured from a change in the amount of charge of the capacitorper unit time. As a result, it is found that in the case where thevoltage between the source electrode and the drain electrode of thetransistor is 3 V, lower off-state current of several tens ofyoctoamperes per micrometer (yA/μm) can be obtained. Consequently, thetransistor including the highly purified oxide semiconductor film as thechannel formation region has extremely small off-state current.

The conductive layers 408 a, 408 b, 408 c, and 408 d are formed to havea single-layer structure or a stacked-layer structure including any ofmetals such as aluminum, titanium, chromium, nickel, copper, yttrium,zirconium, molybdenum, silver, tantalum, and tungsten or an alloycontaining any of these metals as its main component, as a conductivematerial. For example, a two-layer structure in which a titanium film isstacked over an aluminum film; a two-layer structure in which a titaniumfilm is stacked over a tungsten film; a two-layer structure in which acopper film is formed over a copper-magnesium-aluminum alloy film; athree-layer structure in which a titanium film or a titanium nitridefilm, an aluminum film or a copper film, and a titanium film or atitanium nitride film are stacked in this order; and a three-layerstructure in which a molybdenum film or a molybdenum nitride film, analuminum film or a copper film, and a molybdenum film or a molybdenumnitride film are stacked in this order can be given. Note that atransparent conductive material containing indium oxide, tin oxide, orzinc oxide may be used.

In this embodiment, the conductive layers 408 a, 408 b, 408 c, and 408 dare provided over the semiconductor layers 406 a and 406 b; however, theconductive layers 408 a, 408 b, 408 c, and 408 d may be provided betweenthe insulating layer 404 and the semiconductor layers 406 a and 406 b.

As the insulating layer 410, an oxide insulating film is preferably usedso as to improve characteristics of the interface with the oxidesemiconductor film used for the semiconductor layers 406 a and 406 b. Asthe the insulating layer 410, a silicon oxide film, a silicon oxynitridefilm, an aluminum oxide film, a hafnium oxide film, a gallium oxidefilm, a Ga—Zn-based metal oxide film, or the like having a thicknessgreater than or equal to 150 nm and less than or equal to 400 nm can beused.

As the insulating layer 412, a nitride insulating film is preferablyused. For example, a silicon nitride oxide film and a silicon oxide filmcan be given. As a combination of the insulating layer 410 and theinsulating layer 412, a stacked-layer structure of a silicon oxynitridefilm and a silicon nitride oxide film can be used.

For the insulating layer 414, an organic insulating material having heatresistance such as an acrylic-based resin, a polyimide-based resin, abenzocyclobutene-based resin, a polyamide-based resin, or an epoxy-basedresin can be used. Note that the insulating layer 414 may be formed bystacking a plurality of insulating films formed using these materials.With the use of the insulating layer 414, the unevenness in thetransistor and the like can be reduced.

For the conductive layers 416 a, 416 b, and 416 c, a light-transmittingconductive material such as indium oxide containing tungsten oxide,indium zinc oxide containing tungsten oxide, indium oxide containingtitanium oxide, indium tin oxide containing titanium oxide, indium tinoxide (referred to as ITO), indium zinc oxide, or indium tin oxide towhich silicon oxide is added can be used.

For the insulating layer 418, an inorganic insulating material such as asilicon oxide film, a silicon oxynitride film, a silicon nitride oxidefilm, a silicon nitride film, or an aluminum oxide film can be used.

For the conductive layers 420, 421, and 422, a material similar to amaterial used for the conductive layers 416 a, 416 b, and 416 c can beused.

For the coloring layer 426, a material having the property oftransmitting light in a specific wavelength band may be used, and anorganic resin film including a dye or a pigment, or the like can beused.

The insulating layer 424 is provided so that an ionic substance includedin the coloring layer 426 is not dispersed into the liquid crystallayers 428 and 429. However, the insulating layer 424 is not necessarilyprovided, without being limited to that structure.

The liquid crystal layer 428 can be, for example, a layer containing aTN liquid crystal, an STN liquid crystal, an OCB liquid crystal, a VAliquid crystal, an electrically controlled birefringence (ECB) liquidcrystal, a guest host (GH) liquid crystal, a polymer dispersed liquidcrystal, or a discotic liquid crystal can be used.

The liquid crystal layer 429 can be a layer including liquid crystalexhibiting a blue phase, for example. A layer including liquid crystalexhibiting a blue phase contains a liquid crystal composition includingliquid crystal exhibiting a blue phase, a chiral material, aliquid-crystalline monomer, a non-liquid-crystalline monomer, and apolymerization initiator. The liquid crystal exhibiting a blue phase hasa short response time, and has optical isotropy that contributes to theexclusion of the alignment process and reduction of viewing angledependence. Therefore, with the liquid crystal exhibiting a blue phase,the operation speed of the liquid crystal display device can beincreased.

As the sealing material 432, a thermosetting resin, an ultravioletcurable resin, or the like can be used.

Although not illustrated in FIGS. 9A and 9B, an optical member (opticalsubstrate) such as a polarizing member, a retardation member, or ananti-reflection member may be provided as appropriate. For example,circular polarization may be obtained by using a polarizing substrateand a retardation substrate. In addition, a backlight, a side light, orthe like may be used as a light source. A spacer may be provided tocontrol a distance (cell gap) between the substrate 400 and thesubstrate 430. Note that the cell gap determines the thickness of theliquid crystal layers 428 and 429. For example, the spacer can have anyshape, like a columnar spacer or a spherical spacer formed by selectiveetching of an insulating film, or the like.

As a display method in the pixel section 201, a progressive method, aninterlace method, or the like can be employed. Further, color elementscontrolled in a pixel at the time of color display are not limited tothree colors: R, G, and B (R, G, and B correspond to red, green, andblue, respectively). For example, R, G, B, and W (W corresponds towhite); R, G, B, and one or more of yellow, cyan, magenta, and the like;or the like can be used. Further, the sizes of display regions may bedifferent between respective dots of color elements. Note that anembodiment of the present invention is not limited to the application toa display device for color display; the disclosed invention can also beapplied to a display device for monochrome display.

The above is the description of an example of the structure of thedisplay devices illustrated in FIGS. 9A and 9B.

In examples of the display device of this embodiment, a driver circuitis provided over the same substrate as a pixel circuit as described withreference to FIGS. 9A and 9B. Thus, the number of wirings for connectingthe pixel circuit and the driver circuit can be reduced.

Although the variety of films such as the conductive layer, thesemiconductor layer, and the insulating layer which are described in theabove embodiment can be formed by a sputtering method or a plasmachemical vapor deposition (CVD) method, such films may be formed byanother method, e.g., a thermal CVD method. A metal organic chemicalvapor deposition (MOCVD) method or an atomic layer deposition (ALD)method may be employed as an example of a thermal CVD method.

A thermal CVD method has an advantage that no defect due to plasmadamage is generated since it does not utilize plasma for forming a film.

Deposition by a thermal CVD method may be performed in such a mannerthat the pressure in a chamber is set to an atmospheric pressure or areduced pressure, and a source gas and an oxidizer are supplied to thechamber at a time and react with each other in the vicinity of thesubstrate or over the substrate.

Deposition by an ALD method may be performed in such a manner that thepressure in a chamber is set to an atmospheric pressure or a reducedpressure, source gases for reaction are sequentially introduced into thechamber, and then the sequence of the gas introduction is repeated. Forexample, two or more kinds of source gases are sequentially supplied tothe chamber by switching respective switching valves (also referred toas high-speed valves). For example, a first source gas is introduced, aninert gas (e.g., argon or nitrogen) or the like is introduced at thesame time as or after the introduction of the first gas so that thesource gases are not mixed, and then a second source gas is introduced.Note that in the case where the first source gas and the inert gas areintroduced at a time, the inert gas serves as a carrier gas, and theinert gas may also be introduced at the same time as the introduction ofthe second source gas. Alternatively, the first source gas may beexhausted by vacuum evacuation instead of the introduction of the inertgas, and then the second source gas may be introduced. The first sourcegas is adsorbed on the surface of the substrate to form a first layer;then the second source gas is introduced to react with the first layer;as a result, a second layer is stacked over the first layer, so that athin film is formed. The sequence of the gas introduction is repeatedplural times until a desired thickness is obtained, whereby a thin filmwith excellent step coverage can be formed. The thickness of the thinfilm can be adjusted by the number of repetitions times of the sequenceof the gas introduction; therefore, an ALD method makes it possible toaccurately adjust a thickness and thus is suitable for manufacturing aminute FET.

The variety of films such as the conductive layer, the semiconductorlayer, and the inorgenic insulating layer which is described in theabove embodiments can be formed by a thermal CVD method such as a MOCVDmethod or an ALD method. For example, in the case where an InGaZnO_(X)(X>0) film is formed, trimethylindium, trimethylgallium, anddimethylzinc are used. Note that the chemical formula of trimethylindiumis In(CH₃)₃. The chemical formula of trimethylgallium is Ga(CH₃)₃. Thechemical formula of diethyizinc is Zn(CH₃)₂. Without limitation to theabove combination, triethylgallium (chemical formula: (C₂H₅)₃Ga) can beused instead of trimethylgallium and dimethylzinc (chemical formula:(C₂H₅)₂Zn) can be used instead of diethylzinc.

For example, in the case where a hafnium oxide film is formed by adeposition apparatus using an ALD method, two kinds of gases, i.e.,ozone (O₃) as an oxidizer and a source gas which is obtained byvaporizing a solvent and liquid containing a hafnium precursor compound(a hafnium alkoxide solution, typically tetrakis(dimethylamide)hafnium(TDMAH)) are used. Note that the chemical formula oftetrakis(dimethylamide)hafnium is Hf[N(CH₃)₂]₄. Examples of anothermaterial liquid include tetrakis(ethylmethylamide)hafnium.

For example, in the case where an aluminum oxide film is formed by adeposition apparatus using an ALD method, two kinds of gases, e.g., H₂Oas an oxidizer and a source gas which is obtained by vaporizing asolvent and liquid containing an aluminum precursor compound (e.g.,trimethylaluminum (TMA)) are used. Note that the chemical formula oftrimethylaluminum is Al(CH₃)₃. Examples of another material liquidinclude tris(dimethylamide)aluminum, triisobutylaluminum, and aluminumtris(2,2,6,6-tetramethyl-3,5-heptanedionato).

For example, in the case where a silicon oxide film is formed by adeposition apparatus using an ALD method, hexachlorodisilane is adsorbedon a surface where a film is to be formed, chlorine contained in theadsorbate is removed, and radicals of an oxidizing gas (e.g., O₂ ordinitrogen monoxide) are supplied to react with the adsorbate.

For example, in the case where a tungsten film is formed using adeposition apparatus employing ALD, a WF₆ gas and a B₂H₆ gas aresequentially introduced plural times to form an initial tungsten film,and then a WF₆ gas and an H₂ gas are introduced at a time, so that atungsten film is formed. Note that an SiH₄ gas may be used instead of aB₂H₆ gas.

For example, in the case where an oxide semiconductor film, e.g., anInGaZnO film is formed using a deposition apparatus employing ALD, anIn(CH₃)₃ gas and an O₃ gas are sequentially introduced plural times toform an InO₂ layer, a Ga(CH₃)₃ gas and an O₃ gas are introduced at atime to form a GaO layer, and then a Zn(CH₃)₂ gas and an O₃ gas areintroduced at a time to form a ZnO layer. Note that the order of theselayers is not limited to this example. A mixed compound layer such as anInGaO layer, an InZnO layer, or a GaZnO layer may be formed by mixing ofthese gases. Note that although an H₂O gas which is obtained by bubblingwith an inert gas such as Ar may be used instead of an O₃ gas, it ispreferable to use an O₃ gas, which does not contain H. Further, insteadof an In(CH₃)₃ gas, an In(C₂H₅)₃ gas may be used. Instead of a Ga(CH₃)₃gas, a Ga(C₂H₅)₃ gas may be used. Further, instead of an In(CH₃)₃ gas,an In(C₂H₅)₃ gas may be used. Furthermore, a Zn(CH₃)₂ gas may be used.

The structure described in this embodiment can be used in appropriatecombination with the structure described in any of the otherembodiments.

Embodiment 4

In this embodiment, a structure of a transistor which can be used forthe pulse signal output circuit of one embodiment of the presentinvention and the shift register including the pulse signal outputcircuit will be described with reference to FIGS. 10A and 10B, FIGS. 11Ato 11D, and FIGS. 12A to 12C.

FIG. 10A is a cross-sectional view of a transistor which can be used inone embodiment of the present invention.

A transistor illustrated in FIG. 10A includes a substrate 500; aninsulating layer 504 formed over the substrate 500; an oxide stack 506formed over the insulating layer 504; a source electrode layer 508 and adrain electrode layer 509 which are formed over the insulating layer 504and the oxide stack 506; a gate insulating layer 510 formed over theoxide stack 506, the source electrode layer 508, and the drain electrodelayer 509; and a gate electrode layer 512 formed over the gateinsulating layer 510 and overlapping with the oxide stack 506. In thetransistor illustrated in FIG. 10A, an insulating layer 514 having afunction as a protective insulating film covers the transistor.

The substrate 500 can be formed using any of the materials for thesubstrate 400 in the above embodiment.

Here, the insulating layer 504 is an insulating film containing oxygenbecause such insulating film has functions of preventing impurity frombeing diffused from the substrate 500, and supplying oxygen into theoxide stack 506, in particular, an oxide semiconductor layer 506_2 (FIG.10B) in the oxide stack 506. In particular, the insulating layer 504 ispreferably an insulating film containing excess oxygen. An oxideinsulating film containing excess oxygen refers to an oxide insulatingfilm from which oxygen can be released by heat treatment or the like. Inother words, the insulating layer 504 is an oxide insulating film whichcan release oxygen by heating. The insulating layer 504 containingexcess oxygen is preferably a film in which the amount of releasedoxygen when converted into oxygen atoms is 1.0×10¹⁹ atoms/cm³ or more inthermal desorption spectroscopy analysis. Further, excess oxygen refersto oxygen which can be transferred in the oxide semiconductor layer,silicon oxide, or silicon oxynitride by heat treatment, oxygen in excessof an intrinsic stoichiometric composition, or oxygen which can fill Vo(oxygen vacancy) caused by lack of oxygen. Oxygen released from theinsulating layer 504 can be diffused to the channel formation region ofthe oxide stack 506, so that oxygen vacancies which might be formed inthe oxide semiconductor layer 506_2 can be filled with the oxygen. Inthis manner, stable electrical characteristics of the transistor can beachieved.

The gate insulating layer 510 can be formed by referring to a materialin description of the insulating layer 404 in the above embodiment. Thegate electrode layer 512 can be formed by referring to a material indescription of the conductive layers 402 a, 402 b, and 402 c in theabove embodiment. The insulating layer 514 can be formed by referring toa material in description of the insulating layer 412 in the aboveembodiment.

The source electrode layer 508 and the drain electrode layer 509 whichare described in this embodiment have a stacked-layer structure of asource electrode layer 508 a and a source electrode layer 508 b and astacked-layer structure of a drain electrode layer 509 a and a drainelectrode layer 509 b, respectively.

For the source electrode layer 508 a and the drain electrode layer 509a, a conductive material which easily reacts to oxygen can be used. Forexample, Al, Cr, Cu, Ta, Ti, Mo, or W can be used. It is particularlypreferable to use Ti or W having a high melting point because thetemperature in a later process can be relatively high. Note that theconductive material which easily reacts to oxygen includes, in itscategory, a material to which oxygen is easily diffused or transferred.

For the source electrode layer 508 b and the drain electrode layer 509b, a conductive material which does not easily react to oxygen is used.As the conductive material, for example, a conductive nitride such astantalum nitride or titanium nitride, or ruthenium is preferably used.Note that the conductive material which does not easily react to oxygenincludes, in its category, a material to which oxygen is not easilydiffused or transferred.

In the oxide stack 506, an n-type region 507 is formed in a region beingin contact with the source electrode layer 508 a and the drain electrodelayer 509 a.

The n-type region 507 is a part of the oxide stack 506 from which oxygenis extracted to the source electrode layer 508 a and the drain electrodelayer 509 a sides and thus has many oxygen vacancies. In addition, then-type region 507 may contain a component of the source electrode layer508 a and the drain electrode layer 509 a. For example, in the casewhere a tungsten film is used as the source electrode layer 508 a andthe drain electrode layer 509 a, a tungsten element may be contained inthe n-type region 507.

In the case of forming a transistor with an extremely short channellength, the n-type region which is formed by the generation of theoxygen vacancies sometimes extends in the channel length direction ofthe transistor. In that case, electrical characteristics of thetransistor change; for example, the threshold voltage shifts or on andoff of the transistor cannot be controlled with the gate voltage (i.e.,the transistor is on). Accordingly, when a transistor with an extremelyshort channel length is formed, it is not preferable that the conductivematerial which easily reacts to oxygen be used for the source electrodeand the drain electrode.

Thus, in this embodiment, the source electrode and the drain electrodehave stacked-layer structures, and the source electrode layer 508 b andthe drain electrode layer 509 b, which determine the channel length, areformed using the conductive material which does not easily react tooxygen. By the use of the above conductive material which does noteasily react to oxygen for the source electrode layer 508 b and thedrain electrode layer 509 b, generation of oxygen vacancies in thechannel formation region of the oxide stack 506 can be suppressed, sothat change of the channel into an n-type can be suppressed. In thismanner, even a transistor with an extremely short channel length canhave favorable electrical characteristics.

The oxide stack 506 illustrated in FIG. 10A will be described in detailbelow.

The oxide stack 506 includes, as illustrated in FIG. 10B, a first oxidelayer 506_1 formed between the insulating layer 504 and the gateinsulating layer 510, the oxide semiconductor layer 506_2 formed overthe first oxide layer 506_1, and a second oxide layer 506_3 formed overthe oxide semiconductor layer 506_2.

The oxide semiconductor layer 506_2 includes a layer represented by anIn-M-Zn oxide, which contains at least indium, zinc, and M (such as Al,Ga, Ge, Y, Zr, Sn, La, Ce, or Hf). The oxide semiconductor layer 506_2preferably includes indium, because carrier mobility of the transistoris increased. For the oxide semiconductor layer 506_2, a material usedfor the semiconductor layers 406 a and 406 b described in the aboveembodiment can be used.

Each of the first oxide layer 506_1 and the second oxide layer 506_3 isan oxide layer containing one or more kinds of metal elements formingthe the oxide semiconductor layer 506_2.

The first oxide layer 506_1 under the oxide semiconductor layer 506_2includes an oxide layer which is represented by an In-M-Zn oxide (M is ametal such as Al, Ti, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf) and in which theatomic ratio of M to In is higher than that in the oxide semiconductorlayer 506_2. Specifically, as the first oxide layer 506_1, an oxidelayer containing the above element at proportion 1.5 times or more,preferably twice or more, more preferably 3 times or more that in theoxide semiconductor layer 506_2 is used. Any of the above elements ismore strongly bonded to oxygen than indium, and thus has a function ofsuppressing generation of an oxygen vacancy in the oxide layer. That is,an oxygen vacancy is more unlikely to be generated in first oxide layer506_1 than in the oxide semiconductor layer 506_2.

The the second oxide layer 506_3 above the oxide semiconductor layer506_2 includes an oxide layer which is represented by an In-M-Zn oxide(M is a metal such as Al, Ti, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf) and inwhich the atomic ratio of M to In is higher than that in the oxidesemiconductor layer 506_2, like the first oxide layer 506_1.Specifically, as second oxide layer 506_3, an oxide layer containing theabove element at proportion 1.5 times or more, preferably twice or more,more preferably 3 times or more that in the oxide semiconductor layer506_2 is used.

In other words, when each of the first oxide layer 506_1, the oxidesemiconductor layer 506_2, and the second oxide layer 506_3 is anIn-M-Zn oxide layer containing at least indium, zinc, and M (M is ametal element such as Al, Ti, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf), and theatomic ratio of In to M and Zn included in the first oxide layer 506_1is x₁:y₁:z₁, the atomic ratio of In to M and Zn included in the oxidesemiconductor layer 506_2 is x₂:y₂:z₂, and the atomic ratio of In to Mand Zn included in the second oxide layer 506_3 is x₃:y₃:z₃, each ofy₁/x₁ and y₃/x₃ is preferably larger than y₂/x₂. Each of y₁/x₁ and y₃/x₃is 1.5 times or more as large as y₂/x₂, preferably 2 times or more, morepreferably 3 times or more as large as y₂/x₂. At this time, when y₂ isgreater than x₂ in the oxide semiconductor layer 506_2, a transistor canhave stable electrical characteristics. However, when y₂ is 3 times ormore as large as x₂, the field-effect mobility of the transistor isreduced; accordingly, y₂ is preferably smaller than 3 times x₂.

When an In—M—Zn oxide is used for first oxide layer 506_1, the atomicratio between In and M is preferably as follows: the atomic percentageof In is less than 50 atomic % and the atomic percentage of M is greaterthan or equal to 50 atomic %; further preferably, the atomic percentageof In is less than 25 atomic % and the atomic percentage of M is greaterthan or equal to 75 atomic %. When the oxide semiconductor layer 506_2is an In-M-Zn oxide layer, preferably in the atomic ratio of In and M,the proportion of In is 25 atomic % or higher and the proportion of M islower than 75 atomic %, and preferably in the atomic ratio of In and M,the proportion of In is 34 atomic % or higher and the proportion of M islower than 66 atomic %. When the second oxide layer 506_3 is an In—M—Znoxide, it is preferable that, in the atomic ratio of In and M, theproportion of In be less than 50 atomic % and the proportion of M begreater than or equal to 50 atomic %, and it is more preferable that, inthe atomic ratio of In and M, the concentration of In be less than 25atomic % and the proportion of M be greater than or equal to 75 atomic%.

The constituent elements of the first oxide layer 506_1 and the secondoxide layer 506_3 may be different from each other, or their constituentelements may be the same at the same atomic ratios or different atomicratios.

For the first oxide layer 506_1, the oxide semiconductor layer 506_2,and the second oxide layer 506_3, for example, an oxide semiconductorcontaining indium, zinc, and gallium can be used. Specifically, thefirst oxide layer 506_1 is preferably formed using an In—Ga—Zn oxidewhose atomic ratio of In to Ga and Zn is 1:3:2, an In—Ga—Zn oxide whoseatomic ratio of In to Ga and Zn which is 1:6:4, an In—Ga—Zn oxide whoseatomic ratio of In to Ga and Zn is 1:9:6, or an oxide having acomposition is in the neighborhood of any of the above atomic ratios.The oxide semiconductor layer 506_2 can be formed using an In—Ga—Znoxide containing In, Ga, and Zn at an atomic ratio of 1:1:1, an In—Ga—Znoxide containing In, Ga, and Zn at an atomic ratio of 3:1:2, or an oxidecontaining In, Ga, and Zn in the vicinity of the above atomic ratios.The second oxide layer 506_3 is preferably formed using an In—Ga—Znoxide containing In, Ga, and Zn at an atomic ratio of 1:3:2, an In—Ga—Znoxide containing In, Ga, and Zn at an atomic ratio of 1:6:4, an In—Ga—Znoxide containing In, Ga, and Zn at an atomic ratio of 1:9:6, or an oxidecontaining In, Ga, and Zn in the vicinity of the above atomic ratios.

The thicknesses of the first oxide layer 506_1 and the second oxidelayer 506_3 are greater than or equal to 3 nm and less than or equal to100 nm, preferably greater than or equal to 3 nm and less than or equalto 50 nm. The thickness of the oxide semiconductor layer 506_2 isgreater than or equal to 3 nm and less than or equal to 200 nm,preferably greater than or equal to 3 nm and less than or equal to 100nm, further preferably greater than or equal to 3 nm and less than orequal to 50 nm.

It is preferable that each of the first oxide layer 506_1 and the secondoxide layer 506_3 contain one or more kinds of metal elements formingthe oxide semiconductor layer 506_2 and be formed using an oxide layerwhose energy of the minimum conduction band is higher than that of theoxide semiconductor layer 506_2 by 0.05 eV or more, 0.07 eV or more, 0.1eV or more, or 0.15 eV or more and is close to the vacuum level by 2 eVor less, 1 eV or less, 0.5 eV or less, or 0.4 eV or less. That is, it ispreferable that each of the first oxide layer 506_1 and the second oxidelayer 506_3 contain one or more kinds of metal elements forming theoxide semiconductor layer 506_2 and be formed using an oxide layer whoseenergy of the minimum conduction band is higher than that of the oxidesemiconductor layer 506_2 by more than or equal to 0.05 eV and less thanor equal to 2 eV and is close to the vacuum level.

When an electric field is applied to a gate electrode layer (the gateelectrode layer 512 in FIGS. 10A and 10B) in such a structure, a channelis formed in the oxide semiconductor layer 506_2 of the oxide stack 506,because the oxide semiconductor layer 506_2 has low energy at theminimum conduction band. In other words, the second oxide layer 506_3 isformed between the oxide semiconductor layer 506_2 and the gateinsulating layer 510, whereby a structure in which the channel of thetransistor is not in contact with the gate insulating layer 510 can beobtained.

Here, band structures of the case where a silicon oxide film is providedto be in contact with the oxide stack 506 will be described withreference to FIGS. 11A to 11D.

Band structures shown in FIGS. 11A and 11B will be described below.

In FIGS. 11A and 11B, the vertical axis represents electron energy (eV)and the horizontal axis represents distance. Here, EcI1 and EcI2represent energy at the minimum conduction band of the silicon oxidefilm, EcS1 represents energy at the minimum conduction band of the firstoxide layer 506_1, EcS2 represents energy at the minimum conduction bandof the oxide semiconductor layer 506_2, and EcS3 represents energy atthe minimum conduction band of the second oxide layer 506_3.

As shown in FIG. 11A, the energies of the minimum conduction bands ofthe first oxide layer 506_1, the oxide semiconductor layer 506_2, andthe second oxide layer 506_3 are changed continuously. This can beunderstood also from the fact that the compositions of the first oxidelayer 506_1, the oxide semiconductor layer 506_2, and the second oxidelayer 506_3 are close to each other and oxygen is easily diffused.

Note that although the case where the first oxide layer 506_1 and thesecond oxide layer 506_3 are oxide layers having the same energy gap isshown in FIG. 11A, the first oxide layer and the second oxide layer maybe oxide layers having, different energy gaps. For example, FIG. 11Bshows part of the band structure in which EcS1 is higher than EcS3.Alternatively, EcS3 may be higher than EcS1.

According to FIGS. 11A and 11B, in the transistor including the oxidestack 506, a channel is formed in the oxide semiconductor layer whichserves as a well. Note that since the energies of the minimum conductionbands are changed continuously, the oxide stack 506 can also be said tohave a U-shaped well. Further, a channel formed to have such a structurecan also be referred to as a buried channel.

Since each of the first oxide layer 506_1 and the second oxide layer506_3 is an oxide layer containing one or more kinds of metal elementsforming the oxide semiconductor layer 506_2, the oxide stack 506 canalso be referred to as an oxide stack in which layers containing thesame main components are stacked. The oxide stack in which layerscontaining the same main components are stacked is formed to have acontinuous energy band (here, in particular, a well structure having a Ushape in which energies of the minimum conduction bands are changedcontinuously between any two of the layers). This is because when animpurity which forms a defect level such as a trapping center or arecombination center is mixed at an interface between the layers, thecontinuity of the energy band is lost, and thus carriers are trapped ordisappear by recombination at the interface.

In order to form continuous junction, the layers need to be stackedsuccessively without being exposed to the air by using a multi-chamberdeposition system (sputtering system) provided with a load lock chamber.Each chamber of the sputtering system is preferably evacuated to a highvacuum (to about 1×10⁻⁴ Pa to 5×10⁻⁷ Pa) by an adsorption vacuum pumpsuch as a cryopump so that water and the like acting as impurities forthe oxide semiconductor are removed as much as possible. Alternatively,a turbo molecular pump and a cold trap are preferably used incombination to prevent backflow of gas into the chamber through anevacuation system.

Not only high vacuum evaporation in a chamber but also high purity of asputtering gas is necessary to obtain a high-purity intrinsic oxidesemiconductor. When a highly purified gas having a dew point of −40° C.or lower, preferably −80° C. or lower, more preferably −100° C. or loweris used as an oxygen gas or an argon gas used as a sputtering gas,moisture or the like can be prevented from entering an oxidesemiconductor as much as possible.

The first oxide layer 506_1 and the second oxide layer 506_3 which areprovided above and below the oxide semiconductor layer 506_2 each serveas a barrier layer, and can prevent a trap level formed at an interfacebetween the oxide stack 506 and each of the insulating layers which arein contact with the oxide stack 506 from adversely affecting the oxidesemiconductor layer 506_2 which serves as a main carrier path in thetransistor.

For example, oxygen vacancies contained in the oxide semiconductor layerappear as localized states in deep energy area in the energy gap of theoxide semiconductor. A carrier is trapped in such localized states, sothat reliability of the transistor is lowered. For this reason, oxygenvacancies contained in the oxide semiconductor layer need to be reduced.The oxide layers in which oxygen vacancies are less likely to begenerated than in the oxide semiconductor layer 506_2 are provided overand under and in contact with the oxide semiconductor layer 506_2 in theoxide stack 506, whereby oxygen vacancies in the oxide semiconductorlayer 506_2 can be reduced. For example, in the oxide semiconductorlayer 506_2, the absorption coefficient due to the localized levels,which is obtained by measurement by a constant photocurrent method (CPM)is set lower than 1×10⁻³/cm, preferably lower than 1×10⁻⁴/cm.

In addition, when the oxide semiconductor layer 506_2 is in contact withan insulating layer including a different constituent element, aninterface state is sometimes formed at the interface of the two layersand the interface state forms a channel. At this time, a secondtransistor having a different threshold voltage appears, so that anapparent threshold voltage of the transistor is varied. However, sincethe first oxide layer 506_1 contains one or more kinds of metal elementsforming the oxide semiconductor layer 506_2 in the oxide stack 506, aninterface state is less likely to be formed at an interface between thefirst oxide layer 506_1 and the oxide semiconductor layer 506_2. Thus,providing the first oxide layer 506_1 makes it possible to reducefluctuation in the electrical characteristics of the transistor, such asthreshold voltage.

When a channel is formed at an interface between the gate insulatinglayer 510 and the oxide semiconductor layer 506_2, interface scatteringoccurs at the interface and the field-effect mobility of the transistoris decreased. However, since the second oxide layer 506_3 contains oneor more kinds of metal elements forming the the oxide semiconductorlayer 506_2 in the oxide stack 506, scattering of carriers is lesslikely to occur at an interface between the second oxide layer 506_3 andthe the oxide semiconductor layer 506_2, and thus the field-effectmobility of the transistor can be increased.

Further, the first oxide layer 506_1 and the second oxide layer 506_3each also serve as a barrier layer which suppresses formation of animpurity level due to the entry of the constituent elements of theinsulating layers which are in contact with the oxide stack 506 (theinsulating layer 504 and the gate insulating layer 510) into the oxidesemiconductor layer 506_2.

For example, in the case of using a silicon-containing insulating layeras each of the insulating layer 504 or the gate insulating layer 510which are in contact with the oxide stack 506, the silicon in theinsulating layers or carbon which might be contained in the insulatinglayers enters the first oxide layer 506_1 or the second oxide layer506_3 at a depth of several nanometers from the interface in some cases.An impurity such as silicon, carbon; or the like entering the oxidesemiconductor layer 506_2 forms impurity states. The impurity statesserve as a donor and generates an electron, so that the oxidesemiconductor layer 506_2 may become n-type.

However, when the thicknesses of the first oxide layer 506_1 and thesecond oxide layer 506_3 are larger than several nanometers, theimpurity such as silicon or carbon does not reach the oxidesemiconductor layer 506_2, so that the influence of impurity levels issuppressed.

Here, the concentration of silicon in the oxide semiconductor layer506_2 is lower than or equal to 1×10¹⁸/cm³, preferably lower than orequal to 3×10¹⁷/cm³. In addition, the concentration of carbon in theoxide semiconductor layer 506_2 is lower than or equal to 3×10¹⁸/cm³,preferably lower than or equal to 3×10¹⁷/cm³. It is particularlypreferable to sandwich or surround the oxide semiconductor layer 506_2serving as a carrier path by the first oxide layer 506_1 and the secondoxide layer 506_3 in order to prevent entry of much silicon or carbon,which is a Group 14 element, to the oxide semiconductor layer 506_2.That is, the concentration of silicon and carbon contained in the oxidesemiconductor layer 506_2 is preferably lower than that in the firstoxide layer 506_1 and the second oxide layer 506_3.

Note that the impurity concentration of the oxide semiconductor layercan be measured by secondary ion mass spectrometry (SIMS).

If hydrogen or moisture is contained in the oxide semiconductor layer asan impurity, it can work as a donor and form an n-type region;therefore, in order to achieve a well-shaped structure, it is useful toprovide a protective insulating layer (e.g. a silicon nitride layer) forpreventing entry of hydrogen or moisture from the outside, above theoxide stack 506.

As illustrated in FIGS. 11A to 11D, trap levels derived from an impurityor a defect can be formed in the vicinity of the interfaces between thefirst and the second oxide layers and the insulating films such as thesilicon oxide films. The first and the second oxide layers enable theoxide semiconductor layer and the trap states to be distanced from eachother. However, in the case where an energy difference between EcS1 orEcS3 and EcS2 is small, electrons in the oxide semiconductor layer mightreach the trap state by passing over the energy gap. When the electronsare captured by the trap state, they become negative fixed charge, sothat the threshold voltage of the transistor shifts in the positivedirection.

Thus, the energy gap between EcS1 and EcS2 and the energy gap betweenEcS3 and EcS2 are each preferably greater than or equal to 0.1 eV, morepreferably greater than or equal to 0.15 eV because the amount of changeof the threshold voltage of the transistor is reduced and the transistorhas stable electrical characteristics.

Each of the first oxide layer 506_1, the oxide semiconductor layer506_2, and the second oxide layer 506_3 is formed using a sputteringtarget which contains at least indium (In) and with which a film can beformed by a sputtering method, preferably a DC sputtering method. Whenthe sputtering target contains indium, the conductivity thereof isincreased; therefore, film formation by a DC sputtering method isfacilitated.

As a material forming the first oxide layer 506_1 and the second oxidelayer 506_3, a material which is represented by an In-M-Zn oxide (M is ametal element such as Al, Ti, Ga, Ge, Y, Zr, Sn, La, Ce, or Hf) is used.As M, Ga is preferably used. However, a material with a high proportionof Ga, specifically the material represented as InGa_(x)Zn_(y)O_(z) withX exceeding 10, is not suitable because powder may be generated in thedeposition and deposition by a DC sputtering method may becomedifficult.

Note that for each of the first oxide layer 506_1 and the second oxidelayer 506_3, a material in which the proportion of indium in the atomicratio is smaller than a material used for the oxide semiconductor layer506_2 is used. The indium and gallium contents in the first oxide layer404 a and the second oxide layer 404 c can be compared with each otherby time-of-flight secondary ion mass spectrometry (also referred to asTOF-SIMS) or X-ray photoelectron spectrometry (also referred to as XPS).

When the first oxide layer 506_1 contains a constituent element (e.g.silicon) of the insulating layer 504 as an impurity, it might have anamorphous structure. Note that the oxide semiconductor layer 506_2 inwhich a channel is formed preferably has a crystal part. In the casewhere the oxide semiconductor layer 506_2 having a crystal part isstacked over the first oxide layer 506_1 having an amorphous structure,the oxide stack can be referred to as a hetero structure havingdifferent crystal structures.

In addition, the second oxide layer 506_3 may have an amorphousstructure or include a crystal part. Formation of the second oxide layer506_3 over the oxide semiconductor layer 506_2 having a crystal partallows the second oxide layer 506_3 to have a crystal structure. In thiscase, a boundary between the oxide semiconductor layer 506_2 and thesecond oxide layer 506_3 cannot be clearly identified by observation ofthe cross section with a transmission electron microscope (TEM) in somecases. Note that the second oxide layer 506_3 has lower crystallinitythan the oxide semiconductor layer 506_2. Hence, it can be said that theboundary can be determined by the degree of crystallinity.

In the oxide stack 506, at least the oxide semiconductor layer 506_2preferably contains CAAC-OS. For the details of the CAAC-OS, thedescription in Embodiment 3 can be referred to. When the oxidesemiconductor layer 506_2 has high crystallinity like the CAAC-OSdescribed above, the variation of the threshold voltage of thetransistor can be reduced and the electric characteristics can bestable.

Next, band structures shown in FIGS. 11C and 11D will be describedbelow.

In FIGS. 11C and 11D, the vertical axis represents electron energy (eV)and the horizontal axis represents distance. Here, EcI1 and EcI2represent energy at the minimum conduction band of the silicon oxidefilm, EcS1 represents energy at the minimum conduction band of the firstoxide layer 506_1, and EcS2 represents energy at the minimum conductionband of the oxide semiconductor layer 506_2.

FIG. 11C is a modification example of the band structure shown in FIG.11A. FIG. 11D is a modification example of the band structure shown inFIG. 11B. Specifically, FIGS. 11C and 11D show a band structure whereEcS3 which represents the energy at the minimum conduction band of thesecond oxide layer 506_3 in FIGS. 11A and 11B is not provided, and EcS2of the energy at the minimum conduction band on the EcI2 side is high.

For example, in the transistor illustrated in FIG. 10A, the uppersurface of the oxide stack 506, that is, the second oxide layer 506_3 issometimes etched when the source electrode layer 508 b and the drainelectrode layer 509 b are formed. However, when the second oxide layer506_3 is formed, a mixed layer of the oxide semiconductor layer 506_2and the second oxide layer 506_3 might be formed on the upper surface ofthe oxide semiconductor layer 506_2.

In the case where the oxide semiconductor layer 506_2 contains In—Ga—Znoxide at an atomic ratio of In:Ga:Zn=1:1:1 or In:Ga:Zn=3:1:2 and thesecond oxide layer 506_3 contains In—Ga—Zn oxide at an atomic ratio ofIn:Ga:Zn=1:3:2 or In:Ga:Zn=1:6:4, the second oxide layer 506_3 containsmore Ga than the oxide semiconductor layer 506_2 does; accordingly, aGaO_(x) layer or a mixed layer which contains more Ga than the oxidesemiconductor layer 506_2 does may be formed on the upper surface theoxide semiconductor layer 506_2.

Therefore, it is possible that the band structure illustrated in FIGS.11C and 11D be realized as the result of increase in EcS2 of the energyat the minimum conduction band on the EcI2 side.

As described above, an oxide stack is provided to be in contact with anoxide semiconductor to form an oxide stack including the oxidesemiconductor and the oxide, whereby it is possible to prevent animpurity such as hydrogen or moisture or an impurity contained in aninsulating film in contact with the oxide semiconductor from enteringthe oxide semiconductor film and forming a carrier.

In addition, with such a structure of the oxide stack, interfacescattering hardly occurs at the interface between the oxide and theoxide semiconductor. Thus, motion of carriers is not impeded at theinterface, resulting in higher electric-field mobility of thetransistor. In addition, the formation of the oxide in contact with theoxide semiconductor can prevent impurities from entering the oxidesemiconductor film, so that the transistor including the oxidesemiconductor can have stable electrical characteristics.

In addition, the oxide stack 506 including the oxide semiconductor layer506_2 can have the structure shown in FIGS. 12A to 12C.

FIGS. 12A to 12C illustrate examples of a cross-sectional structure ofthe oxide stack 506. The oxide stack 506 includes the first oxide layer506_1 over the insulating layer 504, the oxide semiconductor layer 506_2over the first oxide layer 506_1, the second oxide layer 506_3 over theoxide semiconductor layer 506_2, and a third oxide layer 506_4 incontact with side surfaces of the oxide semiconductor layer 506_2 andthe second oxide layer 506_3. In this case, the oxide semiconductorlayer 506_2 is surrounded by the first oxide layer 506_1, the secondoxide layer 506_3, and the third oxide layer 506_4. The third oxidelayer 506_4 is in contact with the gate insulating layer 510.

The oxide stack 506 illustrated in FIG. 12A has a curved surface withone arbitrary curvature radius or plural arbitrary curvature radii. Inthis case, at least a part of the surface of the third oxide layer 506_4in contact with the gate insulating layer 510 is a curved surface.

The third oxide layer 506_4 includes, for example, a material that canbe applied to the first oxide layer 506_1. The third oxide layer 506_4is formed as follows: for example, when the first oxide layer 506_1, thesecond oxide layer 506_3, and the third oxide layer 506_4 are etched bya dry etching method or the like, a reaction product of the first oxidelayer 506_1 is attached to the side surfaces of the oxide semiconductorlayer 506_2 and the second oxide layer 506_3.

In some cases, the insulating layer 504 is overetched and formed in astepped shape in the cross section when the third oxide layer 506_4 isformed.

Note that the first oxide layer 506_1, the second oxide layer 506_3, andthe third oxide layer 506_4 cannot be strictly distinguished from eachother in some cases. For that reason, the oxide semiconductor layer506_2 can be said to be surrounded by the oxide.

Alternatively, the oxide stack 506 may have a structure illustrated inFIG. 12B. The oxide stack 506 illustrated in FIG. 12B has an inclinedregion at an end portion. By formation of the inclined region at the endportion, the coverage with the gate insulating layer 510 can beimproved. Alternatively, a structure in which part of the inclinedregion is cut as illustrated in FIG. 12C may be employed.

As described above, the semiconductor device in this embodiment includesthe oxide stack which is a stacked-layer including the oxidesemiconductor layer and the oxide layers formed over and under and incontact with the oxide semiconductor layer, and in the cross section ofthe oxide stack, the oxide stack has a curved surface or an inclinedregion. Because the cross-section of the oxide stack has a curvedsurface or an inclined curve surface, the coverage of the oxide stackwith a layer to be formed thereover can be improved. Accordingly, a filmcan be formed uniformly over the oxide stack, and thus, intrusion of animpurity element into the oxide stack from a region with low filmdensity or a region without the film formed can be inhibited so thatdeterioration of characteristics of the semiconductor device can beprevented. Therefore, a semiconductor device having stablecharacteristics can be provided.

This embodiment can be freely combined with any of the other embodimentsin this specification.

Embodiment 5

In this embodiment, the deterioration mechanism of an oxidesemiconductor layer will be described with reference to FIG. 13, FIG.14, FIGS. 15A to 15C, FIGS. 16A and 16B, FIGS. 17A and 17B, FIGS. 18Aand 18B, and FIGS. 19A and 19B.

In order to improve reliability of a transistor including an oxidesemiconductor (OS) layer, it is important to clarify a factor thataffects the reliability. Here, in order to improve reliability of thetransistor including an oxide semiconductor layer, the deteriorationmechanism model described below was made.

Note that an oxygen vacancy of the oxide semiconductor layer forms adeep level DOS in the oxide semiconductor layer. In order to reduce thedeep level DOS, it is important to make a state in which the oxidesemiconductor layer contains oxygen in excess of the stoichiometriccomposition and to provide the oxide semiconductor layer to supplyoxygen for repairing the oxygen vacancy from outside.

When a positive gate BT (+GBT: positive gate bias temperature) test isperformed on the transistor including the oxide semiconductor layer, thethreshold voltage (Vth) shifts in the positive direction as compared tothe initial Vg-Id characteristics. In addition, when a negative gate BT(−GBT: negative gate bias temperature) test has been performed on thetransistor on which a positive gate BT test is performed, the Vg-Idcharacteristics shifts in the negative direction. In this manner, thethreshold voltage of the transistor becomes alternately positive andnegative, which is associated with alternation of a positive gate BTtest and a negative gate BT test (see FIG. 13).

FIG. 13 suggests that the change of Vg-Id characteristics of thetransistor including the oxide semiconductor layer relates to not afixed charge but a level (trap level).

FIG. 14 is a model of an energy band diagram of the transistor includingthe oxide semiconductor layer. Note that FIG. 14 shows a state where agate voltage is not applied. In FIG. 14, three kinds of defect states(DOS) were assumed in the oxide semiconductor layer, at the interfacebetween the oxide semiconductor layer and a gate insulating film (“GI”),and the interface between the oxide semiconductor layer and a protectiveinsulating film (“Passivation”). As defect states, there are two kindsof shallow level DOS and one kind of deep level DOS. Note that each ofthe defect states has an energy distribution. Here, the first shallowlevel (wide level DOS) has a large energy distribution, and the secondshallow level (peak level DOS) has a small energy distribution. Inaddition, a difference (ΔEvd) between energy at the top of the valenceband and energy of the deep level DOS is larger than a difference (ΔEcs)between energy at the minimum conduction band and energy of the peaklevel DOS.

For example, the shallow level becomes neutral when its energy is higherthan Fermi energy and is negatively charged when its energy is lowerthan Fermi energy. On the other hand, the deep level is positivelycharged when the energy is larger than Fermi energy and becomes neutralwhen the energy is smaller than Fermi energy.

FIGS. 15A to 15C each show a deterioration mode of Vg-Id characteristicsof the transistor including the oxide semiconductor layer. Thetransistor including the oxide semiconductor layer has three kinds ofdeterioration modes. Specifically, FIG. 15A shows a deterioration modein which the on-state current is decreased, FIG. 15B shows adeterioration mode in which the threshold voltage shifts in the positivedirection, and FIG. 15C shows a deterioration mode in which thethreshold voltage shifts in the negative direction.

What types of defect states cause such deterioration modes of thetransistor including the oxide semiconductor layer will be explainedbelow.

Firstly, the decrease of on-state current shown in FIG. 15A isexplained. When Vg-Id characteristics are measured, as a gate voltageincreases, electrons are trapped by the wide level DOS (see FIG. 16A).At this time, the trapped electrons do not contribute to electricconduction, so that the on-state current of the transistor is decreased,i.e., the line is crushed (see FIG. 16B). Therefore, the decrease ofon-state current of the transistor, which is one of the deteriorationmodes, is probably caused due to the wide level DOS. Note that N in thefigures means Neutral.

Next, the shift of the threshold voltage to the positive side when apositive gate BT test is performed will be explained with reference toFIGS. 17A and 17B.

When a positive gate BT test is performed, electrons induced by apositive gate voltage are trapped by the peak level DOS (see FIG. 17A).The electrons trapped at the time of the positive gate BT test, i.e.,negative charges, have a long relaxation time and thus behave like fixedcharges. Due to the negative charges, even after the gate voltage (bias)is off, a state equal to a state in which a negative voltage iseffectively applied occurs. Therefore, when the electric characteristicsof the transistor are measured after the positive gate BT test, thethreshold voltage of the transistor characteristics (Vg-Idcharacteristics) shifts in the positive direction (see FIG. 17B).

Next, the shift of the threshold voltage to the negative side when anegative gate BT test is performed will be explained with reference toFIGS. 18A and 18B.

When a negative gate voltage Vg is applied to the transistor and thetransistor is irradiated with light in a negative gate BT test, holes,that is, positive charges are trapped by the deep level DOS (see FIG.18A). Since a difference between energy at the minimum conduction band(Ec) and energy of the deep level DOS is larger and a difference betweenenergy at the top of the valence band (Ev) and energy of the deep levelDOS is large, it takes a long time before holes are induced. Inaddition, holes in the oxide semiconductor layer have a large effectivemass, and holes are hardly injected even from a drain electrode. Thepositive charges have a long relaxation time and thus behave like afixed charge. Due to the positive charges, even after the gate voltage(bias) is off, a state equal to a state in which a positive voltage iseffectively applied occurs. Therefore, when the electric characteristicsof the transistor are measured after the negative gate BT test, thethreshold voltage of the transistor characteristics (Vg-Idcharacteristics) shifts in the negative direction (see FIG. 18B).

Next, an n-type region in which an oxide semiconductor layer is incontact with a source electrode and a drain electrode will be describedwith reference to FIGS. 19A and 19B. FIGS. 19A and 19B arecross-sectional views of transistors including an oxide semiconductorlayer. The transistor includes a gate electrode, a gate insulating filmformed over the gate electrode, an oxide semiconductor layer formed overthe gate insulating film, a source electrode and a drain electrodeformed over the oxide semiconductor layer, and an insulating film (exOcontaining insulating film) formed over the oxide semiconductor layer,the source electrode, and the drain electrode.

The oxide semiconductor layer is formed, and then the source electrodeand the drain electrode are formed to be in contact with the oxidesemiconductor layer. For example, when the source electrode and thedrain electrode are formed by a sputtering method, plasma damage to theoxide semiconductor layer or collision of atoms or molecules of amaterial used for the source electrode and the drain electrode due tothe sputtering makes part of the oxide semiconductor layer n-type, sothat an n-type region (n⁺ layer) is formed.

In addition, the n-type region is also formed by heat treatment afterthe source electrode and the drain electrode are formed. For example, bythe heat treatment, hydrogen enters the position of an oxygen vacancy inthe oxide semiconductor layer (VoH is formed) or In contained in theoxide semiconductor layer is reduced, so that the n-type region isformed.

On the other hand, in a region of the oxide semiconductor layer in whichthe source electrode and the drain electrode are not formed, i.e., aregion where a channel is formed, an insulating film containing excessoxygen (exO containing insulating film) is formed to be in contact withthe oxide semiconductor layer. Thus, by performing heat treatment afterthe insulating film containing excess oxygen is formed, oxygen vacanciesare repaired by the excess oxygen (exO) in the oxide semiconductor layerand reduced, whereby the oxide semiconductor layer becomes i-type (ilayer). Note that the cross-sectional view in FIG. 19A is different fromthe cross-sectional view in FIG. 19B in the position of an n-channelregion (n⁺ region). The n-channel region (n⁺ region) may be formed in adifferent part of the oxide semiconductor layer, depending on a materialof the source electrode and the drain electrode, conditions of heattreatment in a manufacturing process of the transistor, or the like.

Note that when the oxide semiconductor layer is an In—Ga—Zn oxide,oxygen which is bonded to indium whose bond energy with oxygen is low iseasily released (i.e., In-Vo is easily formed). Note that the peak levelDOS probably relates to In-VoH and may form an n-type region. The widelevel DOS probably relates to In-Vo-HO—Si. The deep level DOS probablyrelates to In-Vo-In.

In order to reduce the density of defect states in an oxidesemiconductor layer, it is important to reduce oxygen vacancies (Vo).Specifically, oxygen vacancies can be reduced by preventing entry of Siinto the oxide semiconductor layer or by being repaired by excessoxygen. In addition, since VoH is contributed to formation of a shallowlevel which is a defect state, it is preferable to reduce hydrogen inthe oxide semiconductor layer.

Embodiment 6

A display device which is one embodiment of the present invention can beapplied to a variety of electronic appliances (including game machines).Examples of electronic appliances include a television device (alsoreferred to as television or television receiver), a monitor of acomputer or the like, a digital camera, a digital video camera, adigital photo frame, a mobile phone, a portable game machine, a portableinformation terminal, an audio reproducing device, a game machine (e.g.,a pachinko machine or a slot machine), and a game console, and the like.Examples of these electronic devices are illustrated in FIGS. 20A to 20Cand FIGS. 21A to 21C.

FIG. 20A illustrates a table 9000 having a display portion. In the table9000, a display portion 9003 is incorporated in a housing 9001 and animage can be displayed on the display portion 9003. Note that thehousing 9001 is supported by four leg portions 9002. Further, a powercord 9005 for supplying power is provided for the housing 9001.

The display device described in any of the above embodiments can be usedfor the display portion 9003. Thus, the display portion 9003 can havehigh display quality.

The display portion 9003 has a touch-input function. When a user touchesdisplayed buttons 9004 which are displayed on the display portion 9003of the table 9000 with his/her fingers or the like, the user can carryout operation of the screen and input of information. Further, when thetable may be made to communicate with home appliances or control thehome appliances, the display portion 9003 may function as a controldevice which controls the home appliances by operation on the screen.For example, with the use of the display device having an image sensorfunction, the display portion 9003 can have a touch-input function.

Further, the screen of the display portion 9003 can be placedperpendicular to a floor with a hinge provided for the housing 9001;thus, the table 9000 can also be used as a television device. When atelevision device having a large screen is set in a small room, an openspace is reduced; however, when a display portion is incorporated in atable, a space in the room can be efficiently used.

FIG. 20B illustrates a television device 9100. In the television device9100, a display portion 9103 is incorporated in a housing 9101 and animage can be displayed on the display portion 9103. Note that thehousing 9101 is supported by a stand 9105 here.

The television device 9100 can be operated with an operation switch ofthe housing 9101 or a separate remote controller 9110. Channels andvolume can be controlled with an operation key 9109 of the remotecontroller 9110 so that an image displayed on the display portion 9103can be controlled. Furthermore, the remote controller 9110 may beprovided with a display portion 9107 for displaying data output from theremote controller 9110.

The television device 9100 illustrated in FIG. 20B is provided with areceiver, a modem, and the like. With the receiver, general televisionbroadcasts can be received in the television device 9100. Further, whenthe television device 9100 is connected to a communication network bywired or wireless connection vithe modem, one-way (from a transmitter toa receiver) or two-way (between a transmitter and a receiver or betweenreceivers) data communication can be performed.

Any of the display devices described in the above embodiments can beused for the display portions 9103 and 9107. Thus, the television setcan have high display quality.

FIG. 20C illustrates a computer, which includes a main body 9201, ahousing 9202, a display portion 9203, a keyboard 9204, an externalconnection port 9205, a pointing device 9206, and the like.

Any of the display devices described in the above embodiments can beused for the display portion 9203. Thus, the display quality of thecomputer can be improved.

The display portion 9003 has a touch-input function. When a user touchesdisplayed buttons 9004 which are displayed on the display portion 9003of the table 9000 with his/her fingers or the like, the user can carryout operation of the screen and input of information. Further, when thetable may be made to communicate with home appliances or control thehome appliances, the display portion 9003 may function as a controldevice which controls the home appliances by operation on the screen.

Further, the screen of the display portion 9003 can be placedperpendicular to a floor with a hinge provided for the housing 9001;thus, the table 9000 can also be used as a television device. When atelevision device having a large screen is set in a small room, an openspace is reduced; however, when a display portion is incorporated in atable, a space in the room can be efficiently used.

FIGS. 21A and 21B illustrate a tablet terminal that can be folded. InFIG. 21A, the tablet terminal is open and includes a housing 9630, adisplay portion 9631 a, a display portion 9631 b, a display mode switch9034, a power switch 9035, a power saver switch 9036, a fastener 9033,and an operation switch 9038.

Any of the display devices described in the above embodiments can beused for the display portion 9631 a and the display portion 9631 b.Thus, the display quality of the tablet terminal can be improved.

Part of the display portion 9631 a can be a touch panel region 9632 a,and data can be input by touching operation keys 9638 that aredisplayed. Note that FIGS. 21A and 21B show, as an example, that half ofthe area of the display portion 9631 a has only a display function andthe other half of the area has a touch panel function. However, thestructure of the display portion 9631 a is not limited to this, and allthe area of the display portion 9631 a may have a touch panel function.For example, all the area of the display portion 9631 a can displaykeyboard buttons and serve as a touch panel while the display portion9631 b can be used as a display screen.

Like the display portion 9631 a, part of the display portion 9631 b canbe a touch panel region 9632 b. When a finger, a stylus, or the liketouches the place where a button 9639 for switching to keyboard displayis displayed in the touch panel, keyboard buttons can be displayed onthe display portion 9631 b.

Touch input can be performed concurrently on the touch panel regions9632 a and 9632 b.

The switch 9034 for switching display modes can switch displayorientation (e.g., between landscape mode and portrait mode) and selecta display mode (switch between monochrome display and color display),for example. With the switch 9036 for switching to power-saving mode,the luminance of display can be optimized in accordance with the amountof external light at the time when the tablet is in use, which isdetected with an optical sensor incorporated in the tablet. The tabletmay include another detection device such as a sensor for detectingorientation (e.g., a gyroscope or an acceleration sensor) in addition tothe optical sensor.

Although the display portion 9631 a and the display portion 9631 b havethe same display area in FIG. 21A, one embodiment of the presentinvention is not limited to this example. The display portion 9631 a andthe display portion 9631 b may have different areas or different displayquality. For example, one of them may be a display panel that candisplay higher-definition images than the other.

In FIG. 21B, the tablet terminal is folded and includes the housing9630, a solar cell 9633, and a charge and discharge control circuit9634. Note that FIG. 21B shows an example of a structure of the chargeand discharge control circuit 9634 that includes a battery 9635 and aDCDC converter 9636.

Since the tablet can be folded in two, the housing 9630 can be closedwhen the tablet is not in use. Thus, the display portions 9631 a and9631 b can be protected, thereby providing a tablet with high enduranceand high reliability for long-term use.

The tablet terminal illustrated in FIGS. 21A and 21B can also have afunction of displaying various kinds of data (e.g., a still image, amoving image, and a text image), a function of displaying a calendar, adate, the time, or the like on the display portion, a touch-inputfunction of operating or editing data displayed on the display portionby touch input, a function of controlling processing by various kinds ofsoftware (programs), and the like.

The solar battery 9633, which is attached on the surface of the tabletterminal, supplies electric power to a touch panel, a display portion,an image signal processor, and the like. Note that the solar battery9633 can be provided on one or both surfaces of the housing 9630, sothat the battery 9635 can be charged efficiently. When a lithium ionbattery is used as the battery 9635, there is an advantage of downsizingor the like.

The structure and the operation of the charge and discharge controlcircuit 9634 illustrated in FIG. 21B will be described with reference toa block diagram in FIG. 21C. FIG. 21C illustrates the solar cell 9633,the battery 9635, the DC-to-DC converter 9636, a converter 9637,switches SW1 to SW3, and a display portion 9631. The battery 9635, theDC-to-DC converter 9636, the converter 9637, and the switches SW1 to SW3correspond to the charge and discharge control circuit 9634 illustratedin FIG. 21B.

First, an example of the operation in the case where power is generatedby the solar cell 9633 using external light is described. The voltage ofpower generated by the solar battery is raised or lowered by the DCDCconverter 9636 so that the power has a voltage for charging the battery9635. Then, when the power from the solar battery 9633 is used for theoperation of the display portion 9631, the switch SW1 is turned on andthe voltage of the power is raised or lowered by the converter 9637 soas to be a voltage needed for the display portion 9631. In addition,when display on the display portion 9631 is not performed, the switchSW1 is turned off and a switch SW2 is turned on so that charge of thebattery 9635 may be performed.

Note that the solar cell 9633 is described as an example of a powergeneration means; however, without limitation thereon, the battery 9635may be charged using another power generation means such as apiezoelectric element or thermoelectric conversion element (Peltierelement). For example, the battery 9635 may be charged with anon-contact power transmission module capable of performing charging bytransmitting and receiving electric power wirelessly (without contact),or any of the other charge means used in combination.

Note that the structures and the like described in this embodiment canbe combined as appropriate with any of the structures and the likedescribed in the other embodiments.

This application is based on Japanese Patent Application serial No.2012-259260 filed with Japan Patent Office on Nov. 28, 2012, the entirecontents of which are hereby incorporated by reference.

What is claimed is:
 1. A semiconductor device comprising: a first inputterminal to which a start pulse signal is input; a second input terminalto which a clock signal is input; a third input terminal to which areset signal is input; a fourth input terminal to which an invertedstart pulse signal is input; a first output terminal from which a pulsesignal is output; a second output terminal from which a pulse signal isoutput; a first transistor; a second transistor; a third transistor; afourth transistor; a fifth transistor; a sixth transistor; a seventhtransistor; an eighth transistor; and a capacitor, wherein one of asource electrode and a drain electrode of the first transistor iselectrically connected to the first input terminal, wherein the other ofthe source electrode and the drain electrode of the first transistor iselectrically connected to a gate electrode of the second transistor, oneelectrode of the capacitor, and one of a source electrode and a drainelectrode of the fifth transistor, wherein a gate electrode of the firsttransistor is electrically connected to the one of the source electrodeand the drain electrode of the first transistor, wherein one of a sourceelectrode and a drain electrode of the second transistor is electricallyconnected to the second input terminal, wherein the other of the sourceelectrode and the drain electrode of the second transistor iselectrically connected to one of a source electrode and a drainelectrode of the third transistor, a gate electrode of the eighthtransistor, and the first output terminal, wherein the other of thesource electrode and the drain electrode of the third transistor iselectrically connected to one of a source electrode and a drainelectrode of the fourth transistor, wherein a gate electrode of thethird transistor is electrically connected to the third input terminal,wherein the other of the source electrode and the drain electrode of thefourth transistor is electrically connected to a wiring to which a firstlow power supply potential is applied, wherein a gate electrode of thefourth transistor is electrically connected to the fourth inputterminal, wherein the other of the source electrode and the drainelectrode of the fifth transistor is electrically connected to one of asource electrode and a drain electrode of the sixth transistor, whereina gate electrode of the fifth transistor is electrically connected tothe third input terminal, wherein the other of the source electrode andthe drain electrode of the sixth transistor is electrically connected toa wiring to which a second low power supply potential lower than thefirst low power supply potential is applied, wherein a gate electrode ofthe sixth transistor is electrically connected to the fourth inputterminal, wherein one of a source electrode and a drain electrode of theseventh transistor is electrically connected to a wiring to which afirst high power supply potential is applied, wherein the other of thesource electrode and the drain electrode of the seventh transistor iselectrically connected to one of a source electrode and a drainelectrode of the eighth transistor and a second output circuit, whereina gate electrode of the seventh transistor is electrically connected toone of a source electrode and a drain electrode of the seventhtransistor, wherein the other of the source electrode and the drainelectrode of the eighth transistor is electrically connected to a wiringto which the second low power supply potential is applied, wherein theother electrode of the capacitor is electrically connected to a firstoutput circuit, wherein the start pulse signal includes the first lowpower supply potential and a high power supply potential, and whereinthe second low power supply potential is applied to the gate electrodeof the second transistor through the fifth transistor and the sixthtransistor, when the start pulse signal is the first low power supplypotential.
 2. The semiconductor device according to claim 1, wherein achannel formation region of each of the first transistor, the secondtransistor, the third transistor, the fourth transistor, the fifthtransistor, the sixth transistor, the seventh transistor, and the eighthtransistor comprises an oxide semiconductor layer.
 3. The semiconductordevice according to claim 1, wherein the first high power supplypotential is lower than the second high power supply potential.
 4. Adisplay device comprising: the semiconductor device according to claim1; and a pixel circuit where data writing and storing of a data signalare controlled by the semiconductor device.
 5. An electronic devicecomprising the display device according to claim 4.